JAJSN53B February   2012  – January 2025 INA230

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements (I2C)
    7. 6.7 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Basic ADC Functions
      2. 7.3.2 Power Calculation
      3. 7.3.3 Alert Pin
    4. 7.4 Device Functional Modes
      1. 7.4.1 Averaging and Conversion Time Considerations
      2. 7.4.2 Filtering and Input Considerations
    5. 7.5 Programming
      1. 7.5.1 Programming the Calibration Register
      2. 7.5.2 Programming the INA230 Power Measurement Engine
        1. 7.5.2.1 Calibration Register and Scaling
      3. 7.5.3 Simple Current Shunt Monitor Usage (No Programming Necessary)
      4. 7.5.4 Default INA230 Settings
      5. 7.5.5 Bus Overview
        1. 7.5.5.1 Serial Bus Address
        2. 7.5.5.2 Serial Interface
      6. 7.5.6 Writing to and Reading From the I2C Serial Interface
        1. 7.5.6.1 High-Speed I2C Mode
      7. 7.5.7 SMBus Alert Response
    6. 7.6 Register Maps
      1. 7.6.1 Configuration Register (00h, Read/Write)
      2. 7.6.2 AVG Bit Settings [11:9]
      3. 7.6.3 VBUS CT Bit Settings [8:6]
      4. 7.6.4 VSH CT Bit Settings [5:3]
      5. 7.6.5 Mode Settings [2:0]
      6. 7.6.6 Data Output Register
        1. 7.6.6.1 Shunt Voltage Register (01h, Read-Only)
        2. 7.6.6.2 Bus Voltage Register (02h, Read-Only) #GUID-A37EA2E7-DC60-42D5-94EF-920B5CD5B7A9/SBOS5477597
        3. 7.6.6.3 Power Register (03h, Read-Only)
        4. 7.6.6.4 Current Register (04h, Read-Only)
        5. 7.6.6.5 Calibration Register (05h, Read/Write)
        6. 7.6.6.6 Mask/Enable Register (06h, Read/Write)
        7. 7.6.6.7 Alert Limit Register (07h, Read/Write)
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 High-Side Sensing Circuit Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Revision History

Changes from Revision A (December 2021) to Revision B (January 2025)

  • ドキュメント全体にわたって表、図、相互参照の採番方法を更新Go
  • Updated thermal performance values for RGT packageGo
  • Modified input bias current typical value for RGT packageGo
  • Updated the description of the input bias current curves in the Typical Characteristics Go

Changes from Revision * (February 2012) to Revision A (December 2021)

  • ESD 定格」表、「推奨動作条件」表、「機能説明」セクション、「デバイスの機能モード」セクション、「アプリケーションと実装」セクション、「電源に関する推奨事項」セクション、「レイアウト」セクション、「デバイスおよびドキュメントのサポート」セクション、「メカニカル、パッケージ、および注文情報」セクションを追加Go
  • ドキュメント全体にわたって表、図、相互参照の採番方法を更新Go
  • DGS (VSSOP) パッケージを追加Go
  • Increased common-mode voltage rangeGo
  • Improved common-mode rejection, offset, and gain error specifications Go