SBVA067A December   2019  – September 2020 TLV733P-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 WSON-6 Package
    2. 2.2 SOT-23-5 Package
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 WSON-6 Package
    2. 4.2 SOT-23-5 Package

3 Failure Mode Distribution (FMD)

The failure mode distribution estimation for TLV733P-Q1 in Table 3-1 comes from the combination of common failure modes listed in standards such as IEC 61508 and ISO 26262, the ratio of sub-circuit function size and complexity and from best engineering judgment.

The failure modes listed in this section reflect random failure events and do not include failures due to misuse or overstress.

Table 3-1 Die Failure Modes and Distribution
Die Failure ModesFailure Mode Distribution (%)
No OUTPUT (output low)50%
OUTPUT High (following input)10%
OUTPUT not in specification35%
Short circuit, any two pins5%