SBVU076 April   2022

 

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3 Board Layout

Figure 3-1 through Figure 3-8 illustrate the board layout for the TPS7A74EVM-068 PCB.

The TPS7A74EVM-068 dissipates power, which may cause some components to experience an increase in temperature. The TPS7A74 LDO and pulsed resistors R12, R13, R14, R15, and R16 are most at risk of raising the junction temperature during normal operation. The LDO may become hot to the touch during normal operation, see the thermal impedance discussion in the TPS7A74 data sheet.

Figure 3-1 Top Assembly Layer and Silk Screen
Figure 3-3 Layer 2
Figure 3-5 Layer 4
Figure 3-7 Bottom Layer Routing
Figure 3-2 Top Layer Routing
Figure 3-4 Layer 3
Figure 3-6 Layer 5
Figure 3-8 Bottom Assembly Layer and Silk Screen