SBVU078 November   2022

 

  1.   Abstract
  2.   Trademarks
  3. 1Introduction
  4. 2Setup
    1. 2.1 LDO Input/Output Connector Descriptions
      1. 2.1.1 VIN and GND
      2. 2.1.2 BIAS and GND
      3. 2.1.3 VOUT and GND
      4. 2.1.4 EN
    2. 2.2 Optional Load Transient Input/Output Connector Descriptions
      1. 2.2.1 VDD and GND
      2. 2.2.2 J16
      3. 2.2.3 J18
      4. 2.2.4 J21
      5. 2.2.5 J22
      6. 2.2.6 J23
      7. 2.2.7 J24
    3. 2.3 TPS7A53A-Q1 LDO Operation and Component Selection
    4. 2.4 Optional Load Transient Circuit Operation
  5. 3Board Layout
  6. 4TPS7A53EVM-080 Schematic
  7. 5Bill of Materials

Board Layout

Figure 3-1 through Figure 3-8 illustrate the board layout for the TPS7A53EVM-080 PCB.

The TPS7A53EVM-080 dissipates power, which can cause some components to experience an increase in temperature. The TPS7A53A-Q1 LDO and pulsed resistors R8, R9, R10, R11, and R12 are most at risk of raising the junction temperature during normal operation. The LDO can become hot to the touch during normal operation, see the thermal impedance discussion in the TPS7A53A-Q1 data sheet.

GUID-20220908-SS0I-V6KP-RLS6-C0ZXKJ2GX7B0-low.jpgFigure 3-1 Top Assembly Layer and Silkscreen
GUID-20220908-SS0I-C375-4V3Q-0CRSVTTXHCN0-low.jpgFigure 3-3 Layer 2
GUID-20220908-SS0I-21VT-DVQP-XQJJT4KNL6NX-low.jpgFigure 3-5 Layer 4
GUID-20220908-SS0I-LZXM-PTVZ-JDXQHRFT6WRP-low.jpgFigure 3-7 Bottom Layer Routing
GUID-20220908-SS0I-JZFL-PNDF-BR8MVJK1V3JT-low.jpgFigure 3-2 Top Layer Routing
GUID-20220908-SS0I-SWSZ-ZQRJ-XBSCFD88JN7V-low.jpgFigure 3-4 Layer 3
GUID-20220908-SS0I-JWBR-99CT-SM1MPTFR1VCG-low.jpgFigure 3-6 Layer 5
GUID-20220908-SS0I-Z3GG-C4ZJ-S97NXT6HDNRD-low.jpgFigure 3-8 Bottom Assembly Layer and Silkscreen