SLLA535 December   2022 TLIN1431-Q1

 

  1. 1Introduction
    1.     Trademarks
  2. 2TLIN1431x-Q1 Hardware Component Functional Safety Capability
  3. 3Development Process for Management of Systematic Faults
    1. 3.1 TI New-Product Development Process
    2. 3.2 TI Functional Safety Development Process
  4. 4TLIN1431x-Q1 Component Overview
    1. 4.1 Targeted Applications
    2. 4.2 Hardware Component Functional Safety Concept
    3. 4.3 Functional Safety Constraints and Assumptions
  5. 5Description of Hardware Component Parts
    1. 5.1 LIN Transceiver
    2. 5.2 Digital Core
    3. 5.3 Power Control IP
    4. 5.4 Digital Input/Output Pins and High-side Switch
  6. 6TLIN1431x-Q1 Management of Random Faults
    1. 6.1 Fault Reporting
    2. 6.2 Functional Safety Mechanism Categories
    3. 6.3 Description of Functional Safety Mechanisms
      1. 6.3.1 LIN Bus and Communication
        1. 6.3.1.1 SM-1: LIN TXD Pin Dominant State Timeout
        2. 6.3.1.2 SM-2: LIN Bus Stuck Dominant System Fault: False Wake Up Lockout
        3. 6.3.1.3 SM-3: LIN Bus Short Circuit Limiter
        4. 6.3.1.4 SM-20: LIN Internal pull-up to VSUP
        5. 6.3.1.5 SM-22: LIN Protocol
      2. 6.3.2 Voltage Rail Monitoring
        1. 6.3.2.1 SM-4: VCC and Transceiver Thermal Shutdown
        2. 6.3.2.2 SM-5: VCC Under-voltage
        3. 6.3.2.3 SM-6: VCC Over-voltage
        4. 6.3.2.4 SM-7: VCC Short to Ground
        5. 6.3.2.5 SM-8: VSUP Under-voltage
      3. 6.3.3 Processor Communication
        1. 6.3.3.1 SM-9 and SM-10: Watchdog
          1. 6.3.3.1.1 SM-9: Standby Mode Long Window Timeout Watchdog
          2. 6.3.3.1.2 SM-10: Normal Mode Watchdog
        2. 6.3.3.2 SM-11: SPI CRC
        3. 6.3.3.3 SM-12: SPI Communication Error; SPIERR
        4. 6.3.3.4 SM-13: Scratchpad Write/Read Register
        5. 6.3.3.5 SM-14: Sleep Wake Error Timer; tINACT_FS
      4. 6.3.4 Digital Input/Output Pins and High-side Switch
        1. 6.3.4.1 SM-15: CLK internal pull-up to VINT
        2. 6.3.4.2 SM-16: SDI internal pull-up to VINT
        3. 6.3.4.3 SM-17: nCS Internal pull-up to VINT
        4. 6.3.4.4 SM-18: DIV_ON Internal pull-down to GND
        5. 6.3.4.5 SM-19: TXD Internal pull-up to VINT
        6. 6.3.4.6 SM-21: nRST Internal pull-up to VINT
        7. 6.3.4.7 SM-23: HSS Over Current Detect
        8. 6.3.4.8 SM-24: HSS Open Load Detect
          1.        A Summary of Recommended Functional Safety Mechanism Usage
            1.         B Distributed Developments
              1.          B.1 How the Functional Safety Lifecycle Applies to TI Functional Safety Products
              2.          B.2 Activities Performed by Texas Instruments
              3.          B.3 Information Provided
                1.           C Revision History

6.3.2.1 SM-4: VCC and Transceiver Thermal Shutdown

The TLIN1431x-Q1 has multiple thermal sensors in the device to monitor the junction temperature of the die. The VCC LDO, LIN transmitter, and high side switch/LIMP cells are monitored. The action taken by the device is determined by which cell junction temperature is exceeded. Exceeding the maximum junction temperature for the LIN transmitter or LDO causes the LIN transmitter into the recessive state and turns off the VCC regulator. The nRST pin is pulled to ground during a LIN or VCC LDO TSD event. Once the over temperature fault condition has been removed and the junction temperature has cooled beyond the hysteresis temperature, the transmitter can be re-enabled. Exceeding the max junction temperature of the high side switch or LIMP cells cause the cells to be turned off.

In SPI mode, there are two interrupts that can be set due to a thermal event. If the LIN transceiver or VCC LDO junction temperature is exceeded the TSD_VCC_LIN interrupt is set and the devices taked the action previously described. If the high side switch or LIMP high side switch max junction temperature is exceeded the TSD_HSS_LIMP interrupt is set and the device takes the action previously described. In SPI mode, the device defaults to support fail-safe mode. The device enters fail-safe mode upon a TSD_VCC_LIN event and LIMP is turned on. Exiting fail-safe mode is the same as when the device is pin controlled. When fail-safe mode is disabled the device enters sleep mode upon a TSD_VCC_LIN event.