SNIK005 august   2023 TMP9R00-SP

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2SEE Mechanisms
    1. 2.1 Test Device and Test Board Information
  6. 3Irradiation Facility and Setup
    1. 3.1 SEL Results
    2. 3.2 SET Results
      1. 3.2.1 Histogram of Temperature Events Exceeding ±1.5°C
    3. 3.3 Event Rate Calculations
  7. 4Summary

1 Introduction

The TMP9R00-SP device is a radiation-hardened, high-accuracy, low-power 8-channel remote temperature sensor monitor with a built-in local temperature sensor. The remote temperature sensors are typically low-cost discrete NPN or PNP transistors, or substrate thermal transistors or diodes that are integral parts of microprocessors, analog-to-digital converters (ADC), digital-to-analog converters (DAC), microcontrollers, or field-programmable gate arrays (FPGA). Temperature is represented as a 13-bit digital code for both local and remote sensors, giving a resolution of 0.0625°C. The two-wire serial interface accepts the SMBus communication protocol with up to four different pin-programmable addresses.

Table 1-1 lists general device information and test conditions. See the TMP9R00-SP Product Page for more detailed technical specifications, user-guides, and application notes.(1)

Table 1-1 Overview Information
Description Device Information(1)

TI Part Number

TMP9R00-SP

SMD Number

5962R2021401VXC

Device Function

Remote and Local Digital Temperature Sensor

Technology

LCB8LV

Exposure Facility

 Facility for Rare Isotope Beams,

Michigan State University

Heavy Ion Fluence per Run

1 × 106 – 1 × 107 ions/cm2

Irradiation Temperature

25°C (SET) and 125°C (SEL)
(1) TI can provide technical, application or design advice, quality characterization, and reliability data or service providing these items shall not expand or otherwise affect TI's warranties as set forth in the Texas Instruments Incorporated Standard Terms and Conditions of Sale for Semiconductor Products and no obligation or liability shall arise from Semiconductor Products and no obligation or liability shall arise from TI's provision of such items.
1. TI can provide technical, application or design advice, quality characterization, and reliability data or service providing these items shall not expand or otherwise affect TI's warranties as set forth in the Texas Instruments Incorporated Standard Terms and Conditions of Sale for Semiconductor Products and no obligation or liability shall arise from Semiconductor Products and no obligation or liability shall arise from TI's provision of such items.