SNIK005 august   2023 TMP9R00-SP

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2SEE Mechanisms
    1. 2.1 Test Device and Test Board Information
  6. 3Irradiation Facility and Setup
    1. 3.1 SEL Results
    2. 3.2 SET Results
      1. 3.2.1 Histogram of Temperature Events Exceeding ±1.5°C
    3. 3.3 Event Rate Calculations
  7. 4Summary

2.1 Test Device and Test Board Information

The TMP9R00-SP is packaged in a 16-pin, thermally enhanced, dual-ceramic flat-pack package (CFP) shown with the pinout in Figure 2-2.

GUID-4089F146-57E9-4D74-B06A-E99EB9CE8BF4-low.svgFigure 2-2 TMP9R00-SP HKT Package 16-Pin CFP Top View
GUID-D5D38068-1411-4255-8873-3527B9DC5426-low.png Figure 2-3 Delidded TMP9R00-SP
GUID-486F40FB-D60C-415E-B543-A64E552FB8BB-low.png Figure 2-4 TMP9R00-SP Board Top View