SPRZ530B april   2022  – june 2023 AM68 , AM68A , TDA4AL-Q1 , TDA4VE-Q1 , TDA4VL-Q1

 

  1.   1
  2. 1Modules Affected
  3. 2Nomenclature, Package Symbolization, and Revision Identification
    1. 2.1 Device and Development-Support Tool Nomenclature
    2. 2.2 Devices Supported
    3. 2.3 Package Symbolization and Revision Identification
  4. 3Silicon Revision 1.0 Usage Notes and Advisories
    1. 3.1 Silicon Revision 1.0 Usage Notes
      1.      i2134
    2. 3.2 Silicon Revision 1.0 Advisories
      1.      i2049
      2.      i2062
      3.      i2063
      4.      i2064
      5.      i2065
      6.      i2079
      7.      i2091
      8.      i2097
      9.      i2103
      10.      i2120
      11.      i2134
      12.      i2137
      13.      i2146
      14.      i2157
      15.      i2159
      16.      i2160
      17.      i2161
      18.      i2163
      19.      i2166
      20.      i2177
      21.      i2189
      22.      i2190
      23.      i2196
      24.      i2197
      25.      i2205
      26.      i2215
      27.      i2216
      28.      i2219
      29.      i2232
      30.      i2234
      31.      i2235
      32.      i2237
      33.      i2242
      34.      i2243
      35.      i2244
      36.      i2245
      37.      i2249
      38.      i2253
      39.      i2271
      40.      i2272
      41.      i2278
      42.      i2279
      43.      i2283
      44.      i2307
      45.      i2308
      46.      i2310
      47.      i2311
      48.      i2312
      49.      i2313
      50.      i2316
      51.      i2320
      52.      i2326
      53.      i2329
      54.      i2351
      55.      i2362
      56.      i2366
      57.      i2371
      58.      i2372
      59.      i2378
      60.      i2381
      61.      i2383
  5.   Trademarks
  6.   Revision History

i2308

PCIe: PCIE_REFCLK mis-wired in package

Details

The die supports 4 pairs of PCIe Refclk output pads, PCIE_REFCLK[3:0]. However, the package only supports one output, PCIE_REFCLK1. The PCIE_REFCLK3 pads are incorrectly connected to the PCIE_REFCLK1_P/N_OUT package pins instead of the PCIE_REFCLK1 pads.

Workaround

Enable the PCIE_REFCLK1_P/N_OUT pins and select the desired source by setting the PCIE_REFCLK3_CLKSEL register instead of the PCIE_REFCLK1_CLKSEL register.

This will be fixed as a rolling change to the package substrate. The package will be modified to connect the die PCIE_REFCLK1 pads to the package PCIE_REFCLK1_P/N_OUT output pins.

Software can future proof for this change by setting both the PCIE_REFCLK1_CLKSEL and PCIE_REFCLK3_CLKSEL registers. Production software on the updated package should only set PCIE_REFCLK1_CLKSEL.