SWRU637 March   2025

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Power Requirements
    2. 2.2 Temperature Range
    3. 2.3 Energy Trace
    4. 2.4 Hardware and Debug Setup
      1. 2.4.1 Using a LaunchPad XDS110 Debug Probe
      2. 2.4.2 Using a Generic XDS110 Debug Probe, Including a Separate LaunchPad
    5. 2.5 BoosterPack Connector Pinout
    6. 2.6 XDS110 Interface Connector
    7. 2.7 Debug Interface Connector
    8. 2.8 Jumper Information
    9. 2.9 Push Buttons
  9. 3Advanced use of the LaunchPad Hardware
    1. 3.1 External Antenna
    2. 3.2 XDS110 GPIOs
    3. 3.3 Reset Selection on BoosterPack Connector
    4. 3.4 I2C Pullup Resistors
  10. 4Software
    1. 4.1 Getting Started
    2. 4.2 Out of Box Demo
  11. 5Hardware Design Files
    1. 5.1 Reference Schematics
    2. 5.2 PCB Layouts
    3. 5.3 Bill of Materials (BOM)
  12. 6Compliance Information
    1. 6.1 CE Compliance
    2. 6.2 REACH Compliance
    3. 6.3 Waste Electrical and Electronic Equipment (WEEE) Compliance
  13. 7Additional Information
    1. 7.1 Trademarks
  14. 8References

3 Advanced use of the LaunchPad Hardware

Note: the topics in this section involve hardware modifications to your development kit. Your board may be damaged if appropriate soldering equipment is not used and proper ESD mitigation procedures are not followed. Make sure you also have the expertise to perform these modifications.