SLIB006A February 2011 – June 2021 TPS81256 , TPS82084 , TPS82085 , TPS82130 , TPS82140 , TPS82150 , TPS82670 , TPS82671 , TPS826711 , TPS826716 , TPS82672 , TPS826721 , TPS82673 , TPS82674 , TPS826745 , TPS82675 , TPS82676 , TPS826765 , TPS82677 , TPS8268090 , TPS8268105 , TPS8268120 , TPS8268150 , TPS8268180 , TPS82692 , TPS82693 , TPS82695 , TPS826951 , TPS82697 , TPS82698 , TPS82740A , TPS82740B , TPSM82810 , TPSM82813 , TPSM82816 , TPSM82821 , TPSM82821A , TPSM82822 , TPSM82822A , TPSM82823 , TPSM82823A
As the marketplace continues to demand size reductions in electronic products, the need for smaller packaging and smaller subsystem packaging becomes paramount. To address these rapidly evolving customer requirements, TI has developed MicroSiP™ power modules, an innovation in System-in-Package (SiP) technology to integrate both the IC and passive components into a single device.
With this technology, TI reaches the smallest solution size and highest levels of integration. This enables an easy-to-use power module for achieving the shortest time-to-market. As with any device package, attention must be given to the printed circuit board (PCB) layout, surface mount (SMT) assembly flow, and rework process. This white paper provides guidelines on each of these aspects, and these guidelines are achievable through normal manufacturing and rework flows.