SBAA651 October   2024 TX7364

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction of TX7364 and Key Specifications
  5. 2Existing Design
  6. 3Advantages of TX7364 over TX7332
  7. 4New Reference Design with TX7364
  8. 5Benefits of New Design
  9. 6Summary
  10. 7References

3 Advantages of TX7364 over TX7332

Table 3-1 highlights the advantages of TX7364 over TX7332.

Table 3-1 Advantages of TX7364 over TX7332
Nominal Specifications TX7332 TX7364 Units Comments
Analog Specifications
Pk-Pk Drive Capability 200 200 V
Channels 32 64 TX7364 offers 2x integration
Drive 1.2 1 A
True RTZ Yes Yes
TRSW ON Impedance 24 26 Ω
Power Consumption Higher Lower mW TX7364 provides a lower power consumption, leading to increased Pulser efficiency for driving the same transducer load.
Thermal Shutdown Yes Yes
Integrated Passives No Yes TX7364 requires less decaps on board, saving board space.
Board Decaps More decaps required Lesser decaps required TX7364 requires far less number of caps on the PCB, saving board area.
Digital Specifications
BF Clock Resolution 5 2.5 ns TX7364 offers half clock resolution
Max delay possible 41 (13bits) 82 (14 bits) Us TX7364 offers 2x delay at max beamformer clock speed of 200MHz
States for wave definition 32 profiles On-chip RAM capable of storing multiple profiles, much larger than 32. TX7364 has 16 on-chip RAMs for storing delay and pattern information
SPI mode CMOS LVDS LVDS interface allows higher speed, lower switching power
SPI speed 100 400 MHz TX7364 offers 4x faster programming speed
SPI error detection None CRC Check TX7364 offers added reliability to prevent erroneous information getting written into the device
Package Specifications
Package Dimensions 17x11 12x12 mm TX7364 comes in 25% lower area, but 2x the number of channels
Pins 260 196 Lower number of pins for easier layout and routing
Pitch 0.8 0.8 Mm Meets IEC requirements, easier for signal routing with space constraint