SBASAI5D May   2023  – February 2026 TMAG5253

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics (Bipolar, TMAG5253BAx)
    6. 6.6  Magnetic Characteristics (Bipolar, TMAG5253BAx)
    7. 6.7  Electrical Characteristics (Unipolar, TMAG5253UAx)
    8. 6.8  Magnetic Characteristics (Unipolar, TMAG5253UAx)
    9. 6.9  Typical Characteristics (Bipolar, TMAG5253BAx)
    10. 6.10 Typical Characteristics (Unipolar, TMAG5253UAx)
  8. 7 Parameter Measurement Information
    1. 7.1 Sensitivity Linearity
    2. 7.2 Ratiometric Architecture
    3. 7.3 Sensitivity Temperature Compensation
    4. 7.4 Quiescent Voltage Temperature Drift
    5. 7.5 Power-On Time
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Magnetic Flux Direction
      2. 8.3.2 Hall Element Location
      3. 8.3.3 Magnetic Response
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Selecting the Sensitivity Option
      2. 9.1.2 Temperature Compensation for Magnets
      3. 9.1.3 Adding a Low-Pass Filter
      4. 9.1.4 Designing With Multiple Sensors
      5. 9.1.5 Duty-Cycled, Low-Power Design
    2. 9.2 Typical Applications
      1. 9.2.1 Slide-By Displacement Sensing
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Head-On Displacement Sensing
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
      3. 9.2.3 Remote-Sensing Applications
    3. 9.3 Best Design Practices
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

9.2.1.1 Design Requirements

Use the parameters listed in Table 9-3 for this design example.

Table 9-2 Design Parameters
DESIGN PARAMETEREXAMPLE VALUE
VCC3.3V
Magnet5 × 5 × 5mm NdFeB

(Grade N52)

Travel distance (d2 – d1)20mm
Airgap3.0mm (top of package to magnet) + 0.13mm (distance from top of package to sensor location)

Maximum B at sensor at 25°C

±80mT

Device optionTMAG5253BA3