SBASAI5D May   2023  – February 2026 TMAG5253

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics (Bipolar, TMAG5253BAx)
    6. 6.6  Magnetic Characteristics (Bipolar, TMAG5253BAx)
    7. 6.7  Electrical Characteristics (Unipolar, TMAG5253UAx)
    8. 6.8  Magnetic Characteristics (Unipolar, TMAG5253UAx)
    9. 6.9  Typical Characteristics (Bipolar, TMAG5253BAx)
    10. 6.10 Typical Characteristics (Unipolar, TMAG5253UAx)
  8. 7 Parameter Measurement Information
    1. 7.1 Sensitivity Linearity
    2. 7.2 Ratiometric Architecture
    3. 7.3 Sensitivity Temperature Compensation
    4. 7.4 Quiescent Voltage Temperature Drift
    5. 7.5 Power-On Time
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Magnetic Flux Direction
      2. 8.3.2 Hall Element Location
      3. 8.3.3 Magnetic Response
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Selecting the Sensitivity Option
      2. 9.1.2 Temperature Compensation for Magnets
      3. 9.1.3 Adding a Low-Pass Filter
      4. 9.1.4 Designing With Multiple Sensors
      5. 9.1.5 Duty-Cycled, Low-Power Design
    2. 9.2 Typical Applications
      1. 9.2.1 Slide-By Displacement Sensing
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Head-On Displacement Sensing
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
      3. 9.2.3 Remote-Sensing Applications
    3. 9.3 Best Design Practices
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

9.2.3 Remote-Sensing Applications

For remote-sensing applications where the sensor is not physically placed on the same board as the ADC or the microcontroller, the ability to drive a capacitive load from the wiring harness is important. The TMAG5253 enables remote-sensing applications with the ability to support up to 1nF capacitive load on the OUT pin. With a typical cable capacitance of about 100pF/m, the TMAG5253 can support up to 10m in cable length.

TMAG5253 Remote-Sensing Application With Wire Break DetectionFigure 9-10 Remote-Sensing Application With Wire Break Detection

Some remote-sensing applications can require a device to detect if interconnect wires open or short. The TMAG5253 can support this feature with the ability to drive up to ±1mA current load on the output. To design for wire break detection, first select a sensitivity option that causes the output voltage to stay within the VL range during normal operation. Second, add a pullup resistor between OUT and VCC. TI recommends a value between 20kΩ to 100kΩ, and the current through OUT must not exceed the IO specification, including current going into an external ADC. Then, if the output voltage is ever measured to be within 100mV of VCC or GND, a fault condition exists. Figure 9-10 shows the circuit, and Table 9-4 describes fault scenarios.

Table 9-4 Fault Scenarios and the Resulting VOUT
FAULT SCENARIOVOUT
VCC disconnectsClose to GND
GND disconnectsClose to VCC
VCC shorts to OUTClose to VCC
GND shorts to OUTClose to GND