SBASB79A November   2024  – February 2026 TAA3020

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements: I2C Interface
    7. 5.7  Switching Characteristics: I2C Interface
    8. 5.8  Timing Requirements: TDM, I2S or LJ Interface
    9. 5.9  Switching Characteristics: TDM, I2S or LJ Interface
    10. 5.10 Timing Requirements: PDM Digital Microphone Interface
    11. 5.11 Switching Characteristics: PDM Digial Microphone Interface
    12. 5.12 Timing Diagrams
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Serial Interfaces
        1. 6.3.1.1 Control Serial Interfaces
        2. 6.3.1.2 Audio Serial Interfaces
          1. 6.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 6.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 6.3.1.2.3 Left-Justified (LJ) Interface
        3. 6.3.1.3 Using Multiple Devices With Shared Buses
      2. 6.3.2  Phase-Locked Loop (PLL) and Clock Generation
      3. 6.3.3  Input Channel Configurations
      4. 6.3.4  Reference Voltage
      5. 6.3.5  Programmable Microphone Bias
      6. 6.3.6  Signal-Chain Processing
        1. 6.3.6.1 Programmable Channel Gain and Digital Volume Control
        2. 6.3.6.2 Programmable Channel Gain Calibration
        3. 6.3.6.3 Programmable Channel Phase Calibration
        4. 6.3.6.4 Programmable Digital High-Pass Filter
        5. 6.3.6.5 Programmable Digital Biquad Filters
        6. 6.3.6.6 Programmable Channel Summer and Digital Mixer
        7. 6.3.6.7 Configurable Digital Decimation Filters
          1. 6.3.6.7.1 Linear Phase Filters
            1. 6.3.6.7.1.1 Sampling Rate: 7.35kHz to 8kHz
            2. 6.3.6.7.1.2 Sampling Rate: 14.7kHz to 16kHz
            3. 6.3.6.7.1.3 Sampling Rate: 22.05kHz to 24kHz
            4. 6.3.6.7.1.4 Sampling Rate: 29.4kHz to 32kHz
            5. 6.3.6.7.1.5 Sampling Rate: 44.1kHz to 48kHz
            6. 6.3.6.7.1.6 Sampling Rate: 88.2kHz to 96kHz
            7. 6.3.6.7.1.7 Sampling Rate: 176.4kHz to 192kHz
            8. 6.3.6.7.1.8 Sampling Rate: 352.8kHz to 384kHz
            9. 6.3.6.7.1.9 Sampling Rate: 705.6kHz to 768kHz
          2. 6.3.6.7.2 Low-Latency Filters
            1. 6.3.6.7.2.1 Sampling Rate: 14.7kHz to 16kHz
            2. 6.3.6.7.2.2 Sampling Rate: 22.05kHz to 24kHz
            3. 6.3.6.7.2.3 Sampling Rate: 29.4kHz to 32kHz
            4. 6.3.6.7.2.4 Sampling Rate: 44.1kHz to 48kHz
            5. 6.3.6.7.2.5 Sampling Rate: 88.2kHz to 96kHz
            6. 6.3.6.7.2.6 Sampling Rate: 176.4kHz to 192kHz
          3. 6.3.6.7.3 Ultra-Low Latency Filters
            1. 6.3.6.7.3.1 Sampling Rate: 14.7kHz to 16kHz
            2. 6.3.6.7.3.2 Sampling Rate: 22.05kHz to 24kHz
            3. 6.3.6.7.3.3 Sampling Rate: 29.4kHz to 32kHz
            4. 6.3.6.7.3.4 Sampling Rate: 44.1kHz to 48kHz
            5. 6.3.6.7.3.5 Sampling Rate: 88.2kHz to 96kHz
            6. 6.3.6.7.3.6 Sampling Rate: 176.4kHz to 192kHz
            7. 6.3.6.7.3.7 Sampling Rate: 352.8kHz to 384kHz
      7. 6.3.7  Automatic Gain Controller (AGC)
      8. 6.3.8  Voice Activity Detection (VAD)
      9. 6.3.9  Digital PDM Microphone Record Channel
      10. 6.3.10 Interrupts, Status, and Digital I/O Pin Multiplexing
    4. 6.4 Device Functional Modes
      1. 6.4.1 Sleep Mode or Software Shutdown
      2. 6.4.2 Active Mode
      3. 6.4.3 Software Reset
    5. 6.5 Programming
      1. 6.5.1 Control Serial Interfaces
        1. 6.5.1.1 I2C Control Interface
          1. 6.5.1.1.1 General I2C Operation
            1. 6.5.1.1.1.1 I2C Single-Byte and Multiple-Byte Transfers
              1. 6.5.1.1.1.1.1 I2C Single-Byte Write
              2. 6.5.1.1.1.1.2 I2C Multiple-Byte Write
              3. 6.5.1.1.1.1.3 I2C Single-Byte Read
              4. 6.5.1.1.1.1.4 I2C Multiple-Byte Read
  8. 7 Register Maps
    1. 7.1 Device Configuration Registers
    2. 7.2 Page_0 Registers
    3. 7.3 Page_1 Registers
    4. 7.4 Programmable Coefficient Registers
      1. 7.4.1 Programmable Coefficient Registers: Page 2
      2. 7.4.2 Programmable Coefficient Registers: Page 3
      3. 7.4.3 Programmable Coefficient Registers: Page 4
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Two-Channel Analog Microphone Recording
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Example Device Register Configuration Script for EVM Setup
      2. 8.2.2 Four-Channel Digital PDM Microphone Recording
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Example Device Register Configuration Script for EVM Setup
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

8.5.1 Layout Guidelines

Each system design and printed circuit board (PCB) layout is unique. The layout must be carefully reviewed in the context of a specific PCB design. However, the following guidelines can optimize the device performance:

  • Connect the thermal pad to ground. Use a via pattern to connect the device thermal pad, which is the area directly under the device, to the ground planes. This connection helps dissipate heat from the device.
  • The decoupling capacitors for the power supplies must be placed close to the device pins.
  • The supply decoupling capacitors must be used ceramic type with low ESR.
  • Route the analog differential audio signals differentially on the PCB for better noise immunity. Avoid crossing digital and analog signals to prevent undesirable crosstalk.
  • The device internal voltage references must be filtered using external capacitors. Place the filter capacitors near the VREF pin for optimal performance.
  • Directly tap the MICBIAS pin to avoid common impedance when routing the biasing or supply traces for multiple microphones to avoid coupling across microphones.
  • Directly short the VREF and MICBIAS external capacitors ground terminal to the AVSS pin without using any vias for this connection trace.
  • Place the MICBIAS capacitor (with low equivalent series resistance) close to the device with minimal trace impedance.
  • Use ground planes to provide the lowest impedance for power and signal current between the device and the decoupling capacitors. Treat the area directly under the device as a central ground area for the device, and all device grounds must be connected directly to that area.