SBOS014B September   2000  – January 2026 INA114

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Setting the Gain
      2. 6.1.2 Noise Performance
      3. 6.1.3 Offset Trimming
      4. 6.1.4 Input Bias Current Return Path
      5. 6.1.5 Input Common-Mode Range
      6. 6.1.6 Input Protection
      7. 6.1.7 Output Voltage Sense (SOIC-16 Package Only)
    2. 6.2 Typical Applications
  8. 7Device and Documentation Support
    1. 7.1 Device Nomenclature
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

6.1.7 Output Voltage Sense (SOIC-16 Package Only)

The surface-mount version of the INA114 has a separate output sense feedback connection (pin 12). Pin 12 must be connected to the output terminal (pin 11) for proper operation. (This connection is made internally on the DIP version of the INA114.)

The output sense connection can be used to sense the output voltage directly at the load for best accuracy. Figure 6-5 shows how to drive a load through series interconnection resistance. Remotely located feedback paths can cause instability. This instability can be generally be eliminated with a high-frequency feedback path through C1. Drive heavy loads or long lines by connecting a buffer inside the feedback path (see Figure 6-6).

INA114 Remote Load and Ground Sensing Figure 6-5 Remote Load and Ground Sensing
INA114 Buffered Output for Heavy Loads Figure 6-6 Buffered Output for Heavy Loads