SBOS092C June   1998  – January 2026 XTR106

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Linearization
      2. 6.3.2 Reverse-Voltage Protection
      3. 6.3.3 Overvoltage Surge Protection
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 External Transistor
      2. 7.1.2 Loop Power Supply
      3. 7.1.3 Bridge Balance
      4. 7.1.4 Underscale Current
      5. 7.1.5 Low-Impedance Bridges
      6. 7.1.6 Other Sensor Types
      7. 7.1.7 Radio Frequency Interference
      8. 7.1.8 Error Analysis
    2. 7.2 Typical Applications
    3. 7.3 Layout
    4. 7.4 Layout Guidelines
  9. 8 Device and Documentation Support
    1. 8.1 Device Nomenclature
    2. 8.2 Documentation Support
    3. 8.3 Related Documentation
    4. 8.4 Receiving Notification of Documentation Updates
    5. 8.5 Support Resources
    6. 8.6 Trademarks
    7. 8.7 Electrostatic Discharge Caution
    8. 8.8 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.5 Typical Characteristics

at TA = +25°C, V+ = 24V, and all chip site origins (CSO), unless otherwise noted.

XTR106 Transconductance vs Frequency
 
Figure 5-1 Transconductance vs Frequency
XTR106 Step Response
 CSO: TID
Figure 5-3 Step Response
XTR106 Common-Mode Rejection vs Frequency
 CSO: TID
Figure 5-5 Common-Mode Rejection vs Frequency
XTR106 Input Offset Voltage Drift Production Distribution
 
Figure 5-7 Input Offset Voltage Drift Production Distribution
XTR106 Underscale Current vs Temperature
 
Figure 5-9 Underscale Current vs Temperature
XTR106 Overscale Current vs Temperature
 With External Transistor
Figure 5-11 Overscale Current vs Temperature
XTR106 Zero Output Current Error vs Temperature
 
Figure 5-13 Zero Output Current Error vs Temperature
XTR106 Input Voltage, Input Current, and Zero Output Current Noise Density vs Frequency
 CSO: SHE
Figure 5-15 Input Voltage, Input Current, and Zero Output Current Noise Density vs Frequency
XTR106 Zero Output Current Noise Density vs Frequency
 CSO: TID
Figure 5-17 Zero Output Current Noise Density vs Frequency
XTR106 VREG Output Voltage vs VREG Output Current
 
Figure 5-19 VREG Output Voltage vs VREG Output Current
XTR106 VREF5 vs VREG Output Current
 
Figure 5-21 VREF5 vs VREG Output Current
XTR106 Reference Voltage Drift Production Distribution
 
Figure 5-23 Reference Voltage Drift Production Distribution
XTR106 Step Response
 CSO: SHE
Figure 5-2 Step Response
XTR106 Common-Mode Rejection vs Frequency
 CSO: SHE
Figure 5-4 Common-Mode Rejection vs Frequency
XTR106 Power Supply Rejection vs Frequency
 
Figure 5-6 Power Supply Rejection vs Frequency
XTR106 Input Offset Voltage Change vs VREG And VREF Currents
 
Figure 5-8 Input Offset Voltage Change vs VREG And VREF Currents
XTR106 Underscale Current vs IREF + IREG
 
Figure 5-10 Underscale Current vs IREF + IREG
XTR106 Zero Output Error vs VREF and VREG Currents
 
Figure 5-12 Zero Output Error vs VREF and VREG Currents
XTR106 Zero Output Drift Production Distribution
 
Figure 5-14 Zero Output Drift Production Distribution
XTR106 Input Voltage Noise Density vs Frequency
 CSO: TID
Figure 5-16 Input Voltage Noise Density vs Frequency
XTR106 Input Bias and Offset Current vs Temperature
Figure 5-18 Input Bias and Offset Current vs Temperature
XTR106 VREF5 Reference Transient Response
 
Figure 5-20 VREF5 Reference Transient Response
XTR106 Reference AC Line Rejection vs Frequency
 
Figure 5-22 Reference AC Line Rejection vs Frequency
XTR106 Reference Voltage Deviation vs TemperatureFigure 5-24 Reference Voltage Deviation vs Temperature