SBOS152C August   1987  – December 2025 INA106

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Gain Error and Drift
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
    3. 7.3 Additional Applications
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
      2. 8.1.2 Development Support
        1. 8.1.2.1 PSpice® for TI
        2. 8.1.2.2 TINA-TI (Free Software Download)
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

9 Revision History

Changes from Revision B (March 2025) to Revision C (December 2025)

  • Added description of device flow information in Specifications Go
  • Added all chip site origins (CSO) conditions to the typical test conditions in the Electrical Characteristics Go
  • Changed voltage noise from 1.5 µVpp to 1 µVpp for CSO: SHE in the Electrical Conditions Go
  • Added different fabrication process specifications for voltage noise in the Electrical Characteristics Go
  • Added different fabrication process specifications for short circuit current, sinking and sourcing, in the Electrical Characteristics Go
  • Added different fabrication process specifications for slew rate in the Electrical Characteristics Go
  • Added all chip site origins (CSO) condition to the typical test conditions in the Typical Characteristics Go
  • Added "CSO: SHE" to Step Response, Total Harmonic Distortion and Noise vs Frequency, Maximum VOUT vs IOUT (Negative Swing), and Maximum VOUT vs IOUT (Positive Swing) curves in the Typical Characteristics Go
  • Added Voltage Noise Density vs Frequency curves for CSO: SHE in the Typical Characteristics Go
  • Added Step Response, Total Harmonic Distortion and Noise vs Frequency, Maximum VOUT vs IOUT (Negative Swing), Maximum VOUT vs IOUT (Positive Swing), and Voltage Noise Density vs Frequency curves for CSO: RFB in the Typical Characteristics Go
  • Changed and added INA106 Internal Schematic for each fabrication process in Functional Block Diagram Go
  • Added Part Number flow information table to the Device Nomenclature Go

Changes from Revision A (October 2003) to Revision B (March 2025)

  • Updated the numbering format for tables, figures, and cross-references throughout the document.Go
  • Added the Pin Configuration and Functions, Specifications, Recommended Operating Conditions, Thermal Information, Detailed Description, Overview, Functional Block Diagram, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Layout Guidelines, Layout Example, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections Go
  • Changed Precision Gain = 10 Differential Amplifier graphicGo
  • Added Junction temperature rating in Absolute Maximum tableGo
  • Added more test conditions to the Electrical Characteristics tableGo
  • Changed parameter name in Electrical Characteristics from: Offset voltage vs Temperature to Offset voltage drift Go
  • Changed parameter name in Electrical Characteristics from: Offset voltage vs Supply to Power-supply rejection ratio Go
  • Changed parameter name in Electrical Characteristics from: Offset Voltage vs Time to Long-term stability Go
  • Updated Voltage noise specification in Electrical Characteristics from 1µVPP to 1.5µVPP Go
  • Changed output current parameter in Electrical Characteristics from Current Limit to Short-circuit current for sinking and sourcing scenario Go
  • Updated Full Power Bandwidth in Electrical Characteristics to show bandwidth accounting for the closed loop gainGo
  • Moved the power supply voltage and temperature ranges from the Electrical Characteristics table to the Absolute Maximum Ratings tableGo
  • Changed the Applications sectionGo
  • Changed Figure 7-1 Go
  • Changed Figure 7-2 Go
  • Changed Figure 7-6 Go