SBOS527G December   2010  – September 2025 TMP411-Q1 , TMP411D-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics (TMP411-Q1)
    6. 6.6  Electrical Characteristics (TMP411D-Q1)
    7. 6.7  Timing Characteristics
    8. 6.8  Timing Diagrams
    9. 6.9  Typical Characteristics (TMP411-Q1)
    10. 6.10 Typical Characteristics (TMP411D-Q1)
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Series Resistance Cancellation
      2. 7.3.2 Differential Input Capacitance
      3. 7.3.3 Temperature Measurement Data
      4. 7.3.4 THERM (PIN 4) and ALERT/ THERM2 (PIN 6)
      5. 7.3.5 Sensor Fault
      6. 7.3.6 Undervoltage Lockout (TMP411-Q1 Only)
      7. 7.3.7 Filtering
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SD)
      2. 7.4.2 One-Shot Conversion
    5. 7.5 Programming
      1. 7.5.1  Serial Interface
      2. 7.5.2  Bus Overview
      3. 7.5.3  Timing Diagrams
      4. 7.5.4  Serial Bus Address
      5. 7.5.5  Read/Write Operations
      6. 7.5.6  Time-Out Function
      7. 7.5.7  High-Speed Mode
      8. 7.5.8  General-Call Reset
      9. 7.5.9  Software Reset
      10. 7.5.10 SMBUS Alert Function
  9. 8 Register Map
    1. 8.1  Register Information
    2. 8.2  Pointer Register
    3. 8.3  Temperature Registers
    4. 8.4  Limit Registers
    5. 8.5  Status Register
    6. 8.6  Configuration Register
    7. 8.7  Resolution Register
    8. 8.8  Conversion Rate Register
    9. 8.9  N-factor Correction Register
    10. 8.10 Minimum and Maximum Registers
    11. 8.11 Consecutive Alert Register
    12. 8.12 THERM Hysteresis Register
    13. 8.13 Identification Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

9.2.2 Detailed Design Procedure

The temperature measurement accuracy of the TMP411-Q1 and TMP411D-Q1 depends on the remote or local temperature sensor being at the same temperature as the monitored system point. If the temperature sensor is not in good thermal contact with the part of the system being monitored, then there is a delay in the response of the sensor to a temperature change in the system. For remote temperature sensing applications using a substrate transistor (or a small, SOT-23 transistor) placed close to the device, this delay is typically not a concern.

The local temperature sensor inside the TMP411-Q1 and TMP411D-Q1 monitors the ambient air around the device. The thermal time constant for the TMP411-Q1 and TMP411D-Q1 devices is approximately two seconds. This constant implies that if the ambient air changes quickly by 100°C, the TMP411-Q1 and TMP411D-Q1 take approximately 10 seconds (that is, five thermal time constants) to settle within 1°C of the final value. In most applications, the TMP411-Q1 and TMP411D-Q1 package is in electrical (and thermal contact) with the printed circuit board (PCB), and is subjected to forced airflow. The accuracy of the temperature measurement directly depends on how accurately the PCB and forced airflow temperatures represent the temperature measured by the device. Additionally, the internal power dissipation of the TMP411-Q1 and TMP411D-Q1 can cause the temperature to rise above the ambient or PCB temperature. The internal power dissipated as a result of exciting the remote temperature sensor is negligible because of the small currents used.

TMP411-Q1 (Legacy Chip): For a 5.5V supply and maximum conversion rate of eight conversions per second, the TMP411-Q1 dissipates 2.2mW (PD IQ = 5.5V × 400µA). If the ALERT/ THERM2 and THERM pins are each sinking 1mA, an additional power of 0.8mW is dissipated (PD OUT = 1mA × 0.4V + 1mA × 0.4V = 0.8mW). Total power dissipation equals 3mW (PD IQ + PD OUT) and (with a θJA value of 150°C/W) causes the junction temperature to rise approximately 0.45°C above the ambient.

TMP411-Q1 (New Chip): For a 5.5V supply and maximum conversion rate of eight conversions per second, the TMP411-Q1 dissipates 0.248mW (PD IQ = 5.5V × 45µA). If the ALERT/ THERM2 and THERM pins are each sinking 1mA, an additional power of 0.8mW is dissipated (PD OUT = 1mA × 0.4V + 1mA × 0.4V = 0.8mW). Total power dissipation equals 1.048mW (PD IQ + PD OUT) and (with a θJA value of 162°C/W) causes the junction temperature to rise approximately 0.170°C above the ambient.

TMP411D-Q1: For a 5.5V supply and maximum conversion rate of eight conversions per second, the TMP411D-Q1 dissipates 0.248mW (PD IQ = 5.5V × 45µA). If the ALERT/ THERM2 and THERM pins are each sinking 1mA, an additional power of 0.8mW is dissipated (PD OUT = 1mA × 0.4V + 1mA × 0.4V = 0.8mW). Total power dissipation equals 1.048mW (PD IQ + PD OUT) and (with a θJA value of 182°C/W) causes the junction temperature to rise approximately 0.191°C above the ambient.