SBOSAG3A March 2024 – December 2024 PGA849
PRODUCTION DATA
| PIN | TYPE | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| A0 | 4 | Input | Gain option pin 0 |
| A1 | 5 | Input | Gain option pin 1 |
| A2 | 1 | Input | Gain option pin 2 |
| DA_IN+ | 9 | Input | Connection to output difference amplifier summing node |
| DA_IN– | 12 | Input | Connection to output difference amplifier summing node |
| DGND | 16 | Power | Ground reference for digital-logic and gain-setting pins |
| IN– | 3 | Input | Negative (inverting) input |
| IN+ | 2 | Input | Positive (noninverting) input |
| LVDD | 7 | Power | Output-driver positive supply |
| LVSS | 14 | Power | Output-driver negative supply |
| NC | 8 | — | Do not connect |
| NC | 13 | — | Do not connect |
| OUT | 11 | Output | Output |
| REF | 10 | Input | Reference input. This pin must be driven by a low-impedance source |
| VS+ | 6 | Power | Input-stage positive supply |
| VS– | 15 | Power | Input-stage negative supply |
| Thermal Pad | Thermal pad | — | The thermal pad must be soldered to the printed-circuit board (PCB). Connect thermal pad to a plane or large copper pour that is either floating or electrically connected to VS–, even for applications that have low power dissipation. |