SBVS476A May   2025  – July 2025 TPS7B4258-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information 
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Tracker Output Voltage (VOUT)
        1. 6.3.1.1 Output Voltage Equal to Reference Voltage
        2. 6.3.1.2 Output Voltage Less Than the Reference Voltage
        3. 6.3.1.3 Output Voltage Larger Than the Reference Voltage
      2. 6.3.2 Reverse Current Protection
      3. 6.3.3 Undervoltage Lockout
      4. 6.3.4 Thermal Protection
      5. 6.3.5 Current Limit
      6. 6.3.6 Output Short to Battery
      7. 6.3.7 Tracking Regulator With an Enable Circuit
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Operation With VIN < 3.3V
      4. 6.4.4 Disable With ADJ/EN Control
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Dropout Voltage
      2. 7.1.2 Reverse Current
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input and Output Capacitor Selection
        2. 7.2.2.2 Feedback Resistor Selection
        3. 7.2.2.3 Feedforward Capacitor
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Package Mounting
        2. 7.4.1.2 Board Layout Recommendations to Improve PSRR and Noise Performance
        3. 7.4.1.3 Power Dissipation and Thermal Considerations
        4. 7.4.1.4 Thermal Performance Versus Copper Area
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

4 Pin Configuration and Functions

Figure 4-1 DDA Package, 8-Pin HSOIC (Top View)
Table 4-1 Pin Functions
PINTYPEDESCRIPTION
NAMEDDA
ADJ/EN5IAdjustable and enable input pin. Connect the external reference voltage to this pin. This pin connects to the inverting input of the error amplifier internally. A low signal below VIL disables the device, and a high signal above VIH enables the device. Connect the voltage reference directly, or with a voltage divider to attain output voltages lower than the reference. To compensate for line influences, place a 0.1μF capacitor close to this pin.
DNC2—Do not connect a voltage source to this pin. Either leave the pin floating or connect to GND to improve thermal performance.
FB4IFeedback pin. This pin is connected to the noninverting input of the error amplifier internally and controls the output voltage. For output voltages equal to or less than the external reference voltage, connect this pin directly to the output pin. To attain output voltage values higher than the reference, use a voltage divider with external feedback resistors.
GND6, 3GGND pin. Connect this pin to a low impedance path to ground.
IN8IInput power-supply voltage pin. For best transient response and to minimize input impedance, use the recommended value or larger ceramic capacitor from IN to GND. See the Recommended Operating Conditions table. Place the input capacitor as close to the input pin of the device as possible to compensate for line influences. See the Input and Output Capacitor Selection section for more details.
NC7—Not internally connected. For best thermal performance, connect these pins to GND.
OUT1ORegulated output voltage pin. A capacitor is required from OUT to GND for stability. Select a ceramic capacitor within the range of COUT values provided in the Recommended Operating Conditions table. Place this capacitor as close to output of the device as possible. See the Input and Output Capacitor Selection section for more details.
Thermal PadPadThermal pad. Connect the pad to GND for best possible thermal performance.