SCASE72 January   2025 SN54SC8T164-SEP

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Timing Characteristics
    8. 5.8 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Balanced CMOS Push-Pull Outputs
      2. 6.3.2 SCxT Enhanced Input Voltage
        1. 6.3.2.1 Up Translation
        2. 6.3.2.2 Down Translation
      3. 6.3.3 Clamp Diode Structure
    4. 6.4 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Typical Application
      1. 7.1.1 Application Information
      2. 7.1.2 Design Requirements
        1. 7.1.2.1 Power Considerations
        2. 7.1.2.2 Input Considerations
        3. 7.1.2.3 Output Considerations
      3. 7.1.3 Detailed Design Procedure
      4. 7.1.4 Application Curves
    2. 7.2 Power Supply Recommendations
    3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
      2. 7.3.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Balanced CMOS Push-Pull Outputs

This device includes balanced CMOS push-pull outputs. The term balanced indicates that the device can sink and source similar currents. The drive capability of this device may create fast edges into light loads, so routing and load conditions should be considered to prevent ringing. Additionally, the outputs of this device are capable of driving larger currents than the device can sustain without being damaged. It is important to limit the output power of the device to avoid damage due to overcurrent. The electrical and thermal limits defined in the Absolute Maximum Ratings must be followed at all times.

Unused push-pull CMOS outputs must be left disconnected.