SCDS038M December   1997  – January 2026 SN74CBTLV3126

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Function Table (Each Bus Switch)
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Protocol and Signal Isolation
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Mechanical Data

4 Pin Configuration and Functions

SN74CBTLV3126 D, DGV, PW and DYY Package,14 Pin SOIC, TVSOP, TSSOP and SOT(Top View)Figure 4-1 D, DGV, PW and DYY Package,14 Pin SOIC, TVSOP, TSSOP and SOT(Top View)
SN74CBTLV3126 RGY and BQA Package,14 Pin VQFN and WQFN(Top View)Figure 4-2 RGY and BQA Package,14 Pin VQFN and WQFN(Top View)
Table 4-1 Pin Functions, D, DGV, PW, RGY
PIN TYPE(1) DESCRIPTION
NAME NO.
1A 2 I/O Channel 1 input or output
1B 3 I/O Channel 1 input or output
1OE 1 I Output enable, active high
2A 5 I/O Channel 2 input or output
2B 6 I/O Channel 2 input or output
2OE 4 I Output enable, active high
3A 9 I/O Channel 3 input or output
3B 8 I/O Channel 3 input or output
3OE 10 I Output enable, active high
4A 12 I/O Channel 4 input or output
4B 11 I/O Channel 4 input or output
4OE 13 I Output enable, active high
GND 7 — Ground
VCC 14 P Power supply
Thermal Pad — Exposed thermal pad. There is no requirement to solder this pad; if connected, it should be left floating or tied to GND.
(1) I = input, O = output, I/O = input and output, P = power
SN74CBTLV3126 DBQ Package,16 Pin SSOP(Top View)Figure 4-3 DBQ Package,16 Pin SSOP(Top View)
Table 4-2 Pin Functions, DBQ
PIN TYPE(1) DESCRIPTION
NAME NO.
1A 3 I/O Channel 1 input or output
1B 4 I/O Channel 1 input or output
1OE 2 I Output enable, active high
2A 6 I/O Channel 2 input or output
2B 7 I/O Channel 2 input or output
2OE 5 I Output enable, active high
3A 11 I/O Channel 3 input or output
3B 10 I/O Channel 3 input or output
3OE 12 I Output enable, active high
4A 14 I/O Channel 4 input or output
4B 13 I/O Channel 4 input or output
4OE 15 I Output enable, active high
GND 8 — Ground
NC 9 — No internal connection
VCC 16 P Power supply
(1) I = input, O = output, I/O = input and output, P = power