SCDS039K December   1997  – July 2026 SN74CBTLV3253

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics - D, DBQ, DGV, PW and RGY only
    6. 5.6 Electrical Characteristics - DYY and BQB Package only
    7. 5.7 Switching Characteristics - D, DBQ, DGV, PW and RGY only
    8. 5.8 Switching Characteristics - DYY and BQB Package only
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

8.2.2 Detailed Design Procedure

  1. Recommended Input Conditions:
    • For specified high and low levels, see VIH and VIL in Section 5.3.
    • Inputs and outputs are overvoltage tolerant slowing them to go as high as 4.6V at any valid VCC.
  2. Recommended Output Conditions:
    • Load currents must not exceed ±128mA per channel.
  3. Frequency Selection Criterion:
    • Added trace resistance/capacitance can reduce maximum frequency capability; use layout practices as directed in Section 10.