SCDS040N December   1997  – July 2026 SN74CBTLV3257

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Thermal Information
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Electrical Characteristics - DBQ, DGV, D, PW and RGY only
    6. 5.6 Electrical Characteristics - DYY and BQB Package only
    7. 5.7 Switching Characteristics - DBQ, DGV, D, PW and RGY only
    8. 5.8 Switching Characteristics - DYY and BQB Package only
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

10 Revision History

Changes from Revision M (July 2018) to Revision N (July 2026)

  • Added additional applicationsGo
  • Updated Thermal ratings Go
  • Added Electrical Specification section for new package Go
  • Added Switching Specification section for new packageGo
  • Added Typical Curves Go

Changes from Revision L (October 2016) to Revision M (July 2018)

  • Changed the pin images appearance Go

Changes from Revision K (April 2015) to Revision L (October 2016)

  • Added TSSOP (16) to Device Information tableGo
  • Added Junction temperature, TJ in Absolute Maximum Ratings Go
  • Changed wording in Detailed Design Procedure to clarify device operationGo
  • Added Receiving Notification of Documentation Updates section and Community Resources sectionGo

Changes from Revision J (December 2012) to Revision K (April 2015)

  • Removed Ordering Information table, see Mechanical, Packaging, and Orderable Information Go
  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Added Applications.Go
  • Added Device Information table.Go

Changes from Revision I (October 2003) to Revision J (December 2012)

  • Added QFN ordering info and package pinout Go
  • Added New Packages with 125°C capability Go