SCDS135F September   2003  – August 2026 SN74CB3Q3257

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics - PKG = RGY, PW, DBQ, DGV
    6. 5.6  Electrical Characteristics - PKG = DYY
    7. 5.7  Switching Characteristics, VCC = 2.5V, PKG = RGY, DGV, DBQ, PW
    8. 5.8  Switching Characteristics, VCC = 2.5V, PKG = DYY
    9. 5.9  Switching Characteristics, VCC = 3.3V, PKG= RGY, PW, DGV, DBQ
    10. 5.10 Switching Characteristics, VCC = 3.3V, PKG= DYY
    11. 5.11 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

8.2.2 Detailed Design Procedure

The 0.1µF capacitor must be place as close as possible to the device.