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3.3-V, 2:1 (SPDT), 4-channel general-purpose FET bus switch

SN74CB3Q3257

ACTIVE

Product details

Parameters

Configuration 2:1 SPDT Number of channels (#) 4 Power supply voltage - single (V) 2.5, 3.3 Ron (Typ) (Ohms) 4 Bandwidth (MHz) 500 Operating temperature range (C) -40 to 85 Features Powered-off protection, Supports JTAG signals, Supports SPI signals, Supports input voltage beyond supply Input/output continuous current (Max) (mA) 64 Rating Catalog CON (Typ) (pF) 10.5 Supply current (Typ) (uA) 250 open-in-new Find other Analog switches & muxes

Package | Pins | Size

SSOP (DBQ) 16 29 mm² 4.9 x 6 TSSOP (PW) 16 22 mm² 4.4 x 5 TSSOP (PW) 16 22 mm² 5 x 4.4 TVSOP (DGV) 16 23 mm² 3.6 x 6.4 VQFN (RGY) 16 14 mm² 4 x 3.5 open-in-new Find other Analog switches & muxes

Features

  • High-Bandwidth Data Path
    (up to 500 MHz)
  • 5-V Tolerant I/Os With Device Powered Up or Powered Down
  • Low and Flat ON-State Resistance (ron) Characteristics Over Operating Range
    (ron= 4 Ω Typical)
  • Rail-to-Rail Switching on Data I/O Ports
    • 0- to 5-V Switching With 3.3-V VCC
    • 0- to 3.3-V Switching With 2.5-V VCC
  • Bidirectional Data Flow With Near-Zero Propagation Delay
  • Low Input and Output Capacitance Minimizes Loading and Signal Distortion
    (Cio(OFF) = 3.5 pF Typical)
  • Fast Switching Frequency (f OE = 20 MHz Maximum)
  • Data and Control Inputs Provide Undershoot Clamp Diodes
  • Low Power Consumption
    (ICC = 0.7 mA Typical)
  • VCC Operating Range From 2.3 V to 3.6 V
  • Data I/Os Support 0- to 5-V Signaling Levels
    (0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V)
  • Control Inputs Can Be Driven by TTL or
    5-V/3.3-V CMOS Outputs
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Supports Both Digital and Analog Applications: USB Interface, Differential Signal Interface,
    Bus Isolation, Low-Distortion Signal Gating (1)

(1)For additional information regarding the performance
characteristics of the CB3Q family, refer to the TI application report, CBT-C, CB3T, and CB3Q Signal-Switch Families, SCDA008.

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Description

The SN74CB3Q3257 device is a high-bandwidth FET bus switch utilizing a charge pump to elevate the gate voltage of the pass transistor, providing a low and flat ON-state resistance (ron).

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TMUX1574 ACTIVE 5-V, 2:1 (SPDT), 4-channel analog switch with powered-off protection & 1.8-V input logic Upgraded 2-GHz bandwidth, 2-Ω RON, and 1.8-V logic support
Same functionality but is not pin-for-pin or parametrically equivalent to the compared device:
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Technical documentation

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Type Title Date
* Datasheet SN74CB3Q3257 4-Bit 1-of-2 FET Multiplexer/Demultiplexer 2.5-V/3.3-V Low-Voltage High-Bandwidth Bus Switch datasheet (Rev. D) Jul. 09, 2018
Application note CBT-C, CB3T, and CB3Q Signal-Switch Families (Rev. A) Jun. 30, 2020
Application note Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application note Multiplexers and Signal Switches Glossary Mar. 06, 2020
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
More literature Digital Bus Switch Selection Guide (Rev. A) Nov. 10, 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
User guide Signal Switch Data Book (Rev. A) Nov. 14, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application note Bus FET Switch Solutions for Live Insertion Applications Feb. 07, 2003
Application note CBT-C, CB3T, and CB3Q Signal-Switch Families Feb. 04, 2003

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
document-generic User guide
199
Description
To get started:

Step 1: Hardware
Order TAS2770EVM (for mono) or request TAS2770EVM-STEREO (for stereo) evaluation module & PP-SALB2-EVM learning board (if using speaker protection features)

Step 2: Software
Request PurePath Console 3 (PPC3) control GUI, be sure to indicate you are working with the (...)
Features
  • Stereo or Mono evaluation mode USB input
  • Connect up to eight boards
  • Interface to TAS2559YZEVM for speaker protection evaluation
  • Access to TAS2770 add-in PurePath Console 3
EVALUATION BOARD Download
document-generic User guide
199
Description
The TAS2770EVM-Stereo evaluation module provides developers with a simple to use module pre-configured in as a stereo solution. It is powerful tool kit for assessing stereo or mono implementations of the TAS2770 with or without IV sense. Everything needed for evaluating TAS2770 as a conventional amp (...)
Features
  • Stereo or Mono evaluation mode
  • USB input
  • IV sense evaluation mode
  • Interface to TAS2559YZEVM for speaker protection evaluation
  • Access to TAS2770 add-in PurePath Console 3
EVALUATION BOARD Download
document-generic User guide
Description

The DM38x Digital Video Evaluation Module (DVEVM) enables developers to start immediate evaluation of the DM38x Digital Media Processors and begin building digital video applications such as IP security cameras, action cameras, drones, video doorbells, car digital video recorders and other digital (...)

Features
  • DM388 digital media processor-based development board with 2Gb DDR3
  • Video capture and output of NTSC or PAL signals via component I/O
  • HDMI video output
  • CSI2 and parallel camera input
  • PCIe, SATA 2x, ethernet 2x, USB x2, audio, SD-card slot
INTERFACE ADAPTER Download
document-generic User guide
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


INTERFACE ADAPTER Download
document-generic User guide
10
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel

Design tools & simulation

SIMULATION MODEL Download
SCDJ024.ZIP (28 KB) - HSpice Model
SIMULATION MODEL Download
SCDM049.ZIP (44 KB) - IBIS Model

Reference designs

REFERENCE DESIGNS Download
Stereo Evaluation Module Reference Design of the Digital Input, Class-D, IV Sense Audio Amplifier
TIDA-01572 — This reference design provides a high-performance stereo audio subsystem for use in PC applications. It operates off a single supply, ranging from 4.5 V to 16 V, and features the TAS2770, a digital-input Class-D audio amplifier that provides excellent noise and distortion performance and is (...)
document-generic Schematic document-generic User guide

CAD/CAE symbols

Package Pins Download
SSOP (DBQ) 16 View options
TSSOP (PW) 16 View options
TVSOP (DGV) 16 View options
VQFN (RGY) 16 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

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