3.3-V, 2:1 (SPDT), 4-channel general-purpose FET bus switch
Product details
Parameters
Package | Pins | Size
Features
- High-Bandwidth Data Path
(up to 500 MHz) - 5-V Tolerant I/Os With Device Powered Up or Powered Down
- Low and Flat ON-State Resistance (ron) Characteristics Over Operating Range
(ron= 4 Ω Typical) - Rail-to-Rail Switching on Data I/O Ports
- 0- to 5-V Switching With 3.3-V VCC
- 0- to 3.3-V Switching With 2.5-V VCC
- Bidirectional Data Flow With Near-Zero Propagation Delay
- Low Input and Output Capacitance Minimizes Loading and Signal Distortion
(Cio(OFF) = 3.5 pF Typical) - Fast Switching Frequency (f OE = 20 MHz Maximum)
- Data and Control Inputs Provide Undershoot Clamp Diodes
- Low Power Consumption
(ICC = 0.7 mA Typical) - VCC Operating Range From 2.3 V to 3.6 V
- Data I/Os Support 0- to 5-V Signaling Levels
(0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V) - Control Inputs Can Be Driven by TTL or
5-V/3.3-V CMOS Outputs - Ioff Supports Partial-Power-Down Mode Operation
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human Body Model
(A114-B, Class II) - 1000-V Charged-Device Model (C101)
- 2000-V Human Body Model
- Supports Both Digital and Analog Applications: USB Interface, Differential Signal Interface,
Bus Isolation, Low-Distortion Signal Gating (1)
(1)For additional information regarding the performance
characteristics of the CB3Q family, refer to the TI application report, CBT-C, CB3T, and CB3Q Signal-Switch Families, SCDA008.
All trademarks are the property of their respective owners.
Description
The SN74CB3Q3257 device is a high-bandwidth FET bus switch utilizing a charge pump to elevate the gate voltage of the pass transistor, providing a low and flat ON-state resistance (ron).
Exact equivalent in functionality and parametrics to the compared device:
Same functionality but is not pin-for-pin or parametrically equivalent to the compared device:
Technical documentation
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
Step 1: Hardware
Order TAS2770EVM (for mono) or request TAS2770EVM-STEREO (for stereo) evaluation module & PP-SALB2-EVM learning board (if using speaker protection features)
Step 2: Software
Request PurePath Console 3 (PPC3) control GUI, be sure to indicate you are working with the (...)
Features
- Stereo or Mono evaluation mode USB input
- Connect up to eight boards
- Interface to TAS2559YZEVM for speaker protection evaluation
- Access to TAS2770 add-in PurePath Console 3
Description
Features
- Stereo or Mono evaluation mode
- USB input
- IV sense evaluation mode
- Interface to TAS2559YZEVM for speaker protection evaluation
- Access to TAS2770 add-in PurePath Console 3
Description
The DM38x Digital Video Evaluation Module (DVEVM) enables developers to start immediate evaluation of the DM38x Digital Media Processors and begin building digital video applications such as IP security cameras, action cameras, drones, video doorbells, car digital video recorders and other digital (...)
Features
- DM388 digital media processor-based development board with 2Gb DDR3
- Video capture and output of NTSC or PAL signals via component I/O
- HDMI video output
- CSI2 and parallel camera input
- PCIe, SATA 2x, ethernet 2x, USB x2, audio, SD-card slot
Description
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
Description
Features
- Quick testing of TI's surface mount packages
- Allows suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 16 most popular leadless packages with a single panel
Design tools & simulation
Reference designs
Design files
-
download TIDA-01572 BOM.pdf (74KB) -
download TIDA-01572 Assembly Drawing.pdf (469KB) -
download TIDA-01572 PCB.pdf (2766KB) -
download TIDA-01572 CAD Files.zip (2934KB) -
download TIDA-01572 Gerber.zip (1650KB)
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
SSOP (DBQ) | 16 | View options |
TSSOP (PW) | 16 | View options |
TVSOP (DGV) | 16 | View options |
VQFN (RGY) | 16 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
TI E2E™ forums with technical support from TI engineers
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