SCDS141E October   2003  – September 2026 SN74CB3Q3305

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)SN74CB3Q3305SN74CB3Q3305UNIT
DCU (VSSOP)PW (TSSOP)
8 PINS8 PINS
RθJAJunction-to-ambient thermal resistance

205.3

173.7

°C/W
RθJC(top)Junction-to-case (top) thermal resistance

120.8

85.6

°C/W
RθJBJunction-to-board thermal resistance

118

109.3

°C/W
ψJTJunction-to-top characterization parameter

28.1

27.4

°C/W
ψJBJunction-to-board characterization parameter

117.2

108.6°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance——°C/W
(1) For more information about traditional and new thermal metrics, see the application note, Semiconductor and IC Package Thermal Metrics.