SCDS397B November   2018  – August 2025 TMUX6136

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Thermal Information
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Electrical Characteristics (Dual Supplies: ±15V)
    6. 5.6 Switching Characteristics (Dual Supplies: ±15V)
    7. 5.7 Electrical Characteristics (Single Supply: 12V)
    8. 5.8 Switching Characteristics (Single Supply: 12V)
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
      1. 6.1.1  On-Resistance
      2. 6.1.2  Off-Leakage Current
      3. 6.1.3  On-Leakage Current
      4. 6.1.4  Transition Time
      5. 6.1.5  Break-Before-Make Delay
      6. 6.1.6  Charge Injection
      7. 6.1.7  Off Isolation
      8. 6.1.8  Channel-to-Channel Crosstalk
      9. 6.1.9  Bandwidth
      10. 6.1.10 THD + Noise
      11. 6.1.11 AC Power Supply Rejection Ratio (AC PSRR)
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Ultralow Leakage Current
      2. 6.3.2 Ultralow Charge Injection
      3. 6.3.3 Bidirectional and Rail-to-Rail Operation
    4. 6.4 Device Functional Modes
      1. 6.4.1 Truth Table
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
  9. 8 Power Supply Recommendations
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

5.8 Switching Characteristics (Single Supply: 12V)

at TA = 25°C, VDD = 12V, and VSS = 0V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tTRAN Transition time VS = 8V, RL = 300Ω , CL = 35pF 72 84 ns
VS = 8V, RL = 300Ω , CL = 35pF, TA = –40°C to +85°C 117 ns
VS = 8V, RL = 300Ω , CL = 35pF, TA = –40°C to +125°C 128 ns
tBBM Break-before-make time delay VS = 8V, RL = 300Ω , CL = 35pF, TA = –40°C to +125°C 20 40 ns
QJ Charge injection VS = 6V, RS = 0Ω , CL = 1nF –0.7 pC
OISO Off-isolation RL = 50Ω , CL = 5pF, f = 1MHz -85 dB
XTALK Channel-to-channel crosstalk RL = 50Ω , CL = 5pF, f = 1MHz (Inter-channel: S1x and S2x) –110 dB
RL = 50Ω , CL = 5pF, f = 1MHz (Intra-channel: SxA and SxB) –95 dB
IL Insertion loss RL  =  50Ω , CL = 5pF, f =  1MHz –13 dB
ACPSRR AC Power Supply Rejection Ratio RL= 10kΩ , CL = 5pF, VPP= 0.62V, f= 1MHz –58 dB
BW -3dB Bandwidth RL  =  50Ω , CL = 5pF 650 MHz
CIN Digital input capacitance VIN = 0V or VDD 1.7 pF
CS(OFF) Source off-capacitance VS = 6V, f = 1MHz 2.6 3.7 pF
CS(ON), CD(ON) Source and drain on-capacitance VS = 6V, f = 1MHz 6.3 8.5 pF