5-pA, ±16.5-V, 2:1 (SPDT), 2-channel precision analog switch
Product details
Parameters
Package | Pins | Size
Features
- Wide Supply Range: ±5 V to ±16.5 V (dual) or
10 V to 16.5 V (single) - Latch-Up Performance Meets 100 mA per JESD78 Class II Level A on all Pins
- Low On-Capacitance: 5.5 pF
- Low Input Leakage: 0.5 pA
- Low Charge Injection: –0.4 pC
- Rail-to-Rail Operation
- Low On-Resistance: 120 Ω
- Fast Transition Time: 66 ns
- Break-Before-Make Switching Action
- SELx Pin Connectable to VDD With Integrated Pull-down
- Logic Levels: 2 V to VDD
- Low Supply Current: 17 µA
- Human Body Model (HBM) ESD Protection: ± 2kV on All Pins
- Industry-Standard TSSOP Package
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Description
The TMUX6136 is a complementary metal-oxide semiconductor (CMOS) analog switch containing two independently selectable SPDT switches.The devices work well with dual supplies (±5 V to ±16.5 V), a single supply (10 V to 16.5 V), or asymmetric supplies. The digital select pin (SELx) has transistor-transistor logic (TTL) compatible thresholds, ensuring TTL/ CMOS logic compatibility.
The TMUX6136 switches one of two inputs (Sx) to a common output (D), depending on the status of the SELx pins. Each switch conducts equally well in both directions in the ON position and supports input signal range up to the supplies. In the OFF condition, signal levels up to the supplies are blocked. All switches exhibit break-before-make (BBM) switching action.
The TMUX6136 is part of Texas Instruments Precision Switches and Multiplexers family. The device has very low leakage current and charge injection, allowing them to be used in high-precision measurement applications. The devic also provides excellent isolation by blocking signal levels up to the supplies when the switches are in the OFF position. Low supply current of 17 µA enables usage in portable applications.
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | TMUX6136 ±16.5-V, Low Capacitance, Low-Leakage-Current, Precision, Dual SPDT Switch datasheet | Nov. 28, 2018 |
Application note | Choosing the Right Multiplexer for MCU Expansion | Nov. 19, 2020 | |
Application note | Selecting the Right Texas Instruments Signal Switch (Rev. B) | Apr. 02, 2020 | |
Application note | Multiplexers and Signal Switches Glossary | Mar. 06, 2020 | |
Application note | System Level Protection for High Voltage Analog Multiplexers | Jan. 03, 2017 | |
Technical articles | Does a low-leakage multiplexer really matter in a high-impedance PLC system? | Feb. 19, 2016 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
Design tools & simulation
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
TSSOP (PW) | 16 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
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Support & training
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