SCDS414G December   2019  – March 2026 TMUX1308-Q1 , TMUX1309-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information: TMUX1308-Q1
    5. 6.5  Thermal Information: TMUX1309-Q1
    6. 6.6  Electrical Characteristics
    7. 6.7  Logic and Dynamic Characteristics
    8. 6.8  Timing Characteristics
    9. 6.9  Injection Current Coupling
    10. 6.10 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1  On-Resistance
    2. 7.2  Off-Leakage Current
    3. 7.3  On-Leakage Current
    4. 7.4  Transition Time
    5. 7.5  Break-Before-Make
    6. 7.6  tON(EN) and tOFF(EN)
    7. 7.7  Charge Injection
    8. 7.8  Off Isolation
    9. 7.9  Crosstalk
    10. 7.10 Bandwidth
    11. 7.11 Injection Current Control
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bidirectional Operation
      2. 8.3.2 Rail-to-Rail Operation
      3. 8.3.3 1.8V Logic Compatible Inputs
      4. 8.3.4 Fail-Safe Logic
      5. 8.3.5 Injection Current Control
        1. 8.3.5.1 TMUX13xx-Q1 is Powered, Channel is Unselected, and the Input Signal is Greater Than VDD (VDD = 5V, VINPUT = 5.5V)
        2. 8.3.5.2 TMUX13xx-Q1 is Powered, Channel is Selected, and the Input Signal is Greater Than VDD (VDD = 5V, VINPUT = 5.5V)
        3. 8.3.5.3 TMUX13xx-Q1 is Unpowered and the Input Signal has a Voltage Present (VDD = 0V, VINPUT = 3V)
    4. 8.4 Device Functional Modes
    5. 8.5 Truth Tables
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Short To Battery Protection
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

3 Description

The TMUX1308-Q1 and TMUX1309-Q1 are general purpose complementary metal-oxide semiconductor (CMOS) multiplexers (MUX). The TMUX1308-Q1 is an 8:1, 1-channel (single-ended) mux, while the TMUX1309-Q1 is a 4:1, 2-channel (differential) mux. The devices support bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins ranging from GND to VDD.

The TMUX13xx-Q1 devices have an internal injection current control feature which eliminates the need for external diode and resistor networks typically used to protect the switch and keep the input signals within the supply voltage. The internal injection current control circuitry allows signals on disabled signal paths to exceed the supply voltage without affecting the signal of the enabled signal path. Additionally, the TMUX13xx-Q1 devices do not have an internal diode path to the supply pin, which eliminates the risk of damaging components connected to the supply pin or providing unintended power to the supply rail.

All logic inputs have 1.8V logic compatible thresholds, ensuring both TTL and CMOS logic compatibility when operating with a valid supply voltage. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.

Device Information
PART NUMBERCONFIGURATION(1)PACKAGE(2)BODY SIZE (NOM)(3)
TMUX1308-Q1TMUX1309-Q1Channel 8:1
Channel 4:1		PW (TSSOP, 16)5 mm × 4.4 mm
DYY (SOT-23-THIN, 16)4.2 mm × 2 mm
BQB (WQFN, 16)3.5 mm × 2.5 mm
(2) For more information, see Section 12
(3) The body size (length × width) is a nominal value and does not include pins.