SCES217AA April   1999  – August 2026 SN74LVC1G08

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5.   5
  6. 4 Pin Configuration and Functions
  7. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, CL = 15pF
    7. 5.7  Switching Characteristics, 1.8V and 2.5V
    8. 5.8  Switching Characteristics, 3.3V and 5V
    9. 5.9  Operating Characteristics
    10. 5.10 Typical Characteristics
  8. 6 Parameter Measurement Information
  9.   19
  10. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 Partial Power Down (Ioff)
      3. 7.3.3 Standard CMOS Inputs
      4. 7.3.4 Clamp Diode Structure
      5. 7.3.5 Over-Voltage Tolerant Inputs
    4. 7.4 Device Functional Modes
  11. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  12. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  13. 10Revision History
  14. 11Mechanical, Packaging, and Orderable Information

5.2 ESD Ratings

MINMAXUNIT
V(ESD)Electrostatic dischargeHuman body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)02000V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2)01000
(1) JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.