SCES218AA April   1999  – October 2025 SN74LVC1G14

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics: –40°C to 85°C
    7. 5.7 Switching Characteristics: –40°C to 125°C
    8. 5.8 Operating Characteristics
    9. 5.9 Typical Characteristics
  7.   Parameter Measurement Information
  8. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Balanced High-Drive CMOS Push-Pull Outputs
      2. 6.3.2 CMOS Schmitt-Trigger Inputs
      3. 6.3.3 Clamp Diodes
      4. 6.3.4 Partial Power Down (Ioff)
      5. 6.3.5 Over-Voltage Tolerant Inputs
    4. 6.4 Device Functional Modes
  9. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  10. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  11. 9 Revision History
  12. 10Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)SN74LVC1G14UNIT
DBV
(SOT-23)		DCK
(SC70)		DRL
(SOT-5X3)		DRY
(SON)		DPW
(X2SON)		YZV
(DSBGA)		YZP
(DSBGA)
5 PINS5 PINS5 PINS5 PINS5 PINS4 PINS5 PINS
RθJAJunction-to-ambient thermal resistance357.1371.0296.2369.6522.9168.2146.2°C/W
RθJC(top)Junction-to-case (top) thermal resistance263.7297.5137.3257.6250.52.11.4°C/W
RθJBJunction-to-board thermal resistance264.4258.6145.3230.8384.055.939.8°C/W
ψJTJunction-to-top characterization parameter195.6195.614.777.246.51.10.7°C/W
ψJBJunction-to-board characterization parameter262.2256.2145.9231.0382.856.339.3°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/AN/AN/A174.1N/AN/A°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.