SCES219W April   1999  – August 2026 SN74LVC1G32

PRODUCTION DATA  

  1.   1
  2.   2
  3. 1 Features
  4. 2 Applications
  5. 3 Description
  6. 4 Pin Configuration and Functions
  7. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, CL = 15 pF
    7. 5.7  Switching Characteristics, 1.8 V and 2.5V
    8. 5.8  Switching Characteristics, 3.3 V and 5 V
    9. 5.9  Operating Characteristics
    10. 5.10 Typical Characteristics
  8. 6 Parameter Measurement Information
  9. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 Partial Power Down (Ioff)
      3. 7.3.3 Standard CMOS Inputs
      4. 7.3.4 Clamp Diode Structure
      5. 7.3.5 Over-Voltage Tolerant Inputs
    4. 7.4 Device Functional Modes
  10. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  11. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  12.   50
  13. 10Revision History
  14. 11Mechanical, Packaging, and Orderable Information

10 Revision History

Changes from August 1, 2015 to August 12, 2026 (from Revision V (August 2015) to Revision W (August 2026))

  • Updated Device Information table to include body and package dimensionsGo
  • Added Applications, Device Information table, Pin Configuration and Functions section, ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added Thermal Information tableGo
  • Changed Junction-to-ambient thermal resistance value for DBV package from: 229°C/W to: 357.1°C/WGo
  • Changed Junction-to-case (top) thermal resistance value for DBV package from: 164°C/W to: 263.7°C/WGo
  • Changed Junction-to-board characterization value for DBV package from: 62°C/W to: 264.4°C/WGo
  • Changed Junction-to-top characterization value for DBV package from: 44°C/W to: 195.6°C/WGo
  • Changed Junction-to-board characterization value for DBV package from: 62°C/W to: 262.2°C/WGo
  • Changed Junction-to-ambient thermal resistance value for DCK package from: 278°C/W to: 371°C/WGo
  • Changed Junction-to-case (top) thermal resistance value for DCK package from: 93°C/W to: 297.5°C/WGo
  • Changed Junction-to-board characterization value for DCK package from: 65°C/W to: 258.6°C/WGo
  • Changed Junction-to-top characterization value for DCK package from: 2°C/W to: 195.6°C/WGo
  • Changed Junction-to-board characterization value for DCK package from: 64°C/W to: 256.2°C/WGo
  • Changed Junction-to-ambient thermal resistance value for DRL package from: 243°C/W to: 364.1°C/WGo
  • Changed Junction-to-case (top) thermal resistance value for DRL package from: 78°C/W to: 280.6°C/WGo
  • Changed Junction-to-board characterization value for DRL package from: 78°C/W to: 261.5°C/WGo
  • Changed Junction-to-top characterization value for DRL package from: 10°C/W to: 195.6°C/WGo
  • Changed Junction-to-board characterization value for DRL package from: 77°C/W to: 259.2°C/WGo
  • Added parallel trace spacing recommendation to layout guidelines. Changed wording of "Avoid branches; buffer signals that must branch separately" to "Avoid branches; buffer each signal that must branch separately"Go
  • Updated Overview, Application and Implementation, Device and Documentation Support sections to extend detailed feature descriptions and more detailed information. Go

Changes from Revision U (April 2014) to Revision V (August 2015)

  • Added TJ junction temp spec to Abs Max RatingsGo