Single 2-input, 1.65-V to 5.5-V OR gate
Product details
Parameters
Package | Pins | Size
Features
- Available in the Ultra-Small 0.64 mm2
Package (DPW) with 0.5-mm Pitch - Supports 5-V VCC Operation
- Inputs Accept Voltages to 5.5-V
- Supports Down Translation to VCC
- Max tpd of 3.6 ns at 3.3-V
- Low Power Consumption, 10-µA Max ICC
- ±24-mA Output Drive at 3.3-V
- Ioff Supports Live Insertion, Partial-Power-Down
Mode, and Back-Drive Protection - Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II - ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
Description
This single 2-input positive-OR gate is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC1G32 device performs the Boolean function Y = A + B or Y = A\ + B\ in positive logic.
The CMOS device has high output drive while maintaining low static power dissipation over a broad VCC operating range.
The SN74LVC1G32 device is available in a variety of packages, including the ultra-small DPW package with a body size of 0.8 × 0.8 mm.
Technical documentation
= Top documentation for this product selected by TI
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
Features
- Board design allows for versatility in evaluation
- Supports a wide-range of logic devices
Design tools & simulation
SCEJ254.ZIP (87 KB) - HSpice Model
SCEM168C.ZIP (43 KB) - IBIS Model
SCEM632.ZIP (7 KB) - PSpice Model
Reference designs
TIDA-010025 — This reference design realizes a reinforced isolated three-phase inverter subsystem using isolated IGBT gate drivers and isolated current/voltage sensors. The UCC23513 gate driver used has a 6-pin wide body package with optical LED emulated inputs which enables its use as pin-to-pin replacement to (...)
Design files
-
download TIDA-010025 BOM Files.zip (233KB) -
download TIDA-010025 Assembly Files.zip (1084KB) -
download TIDA-010025 Layer Plots.zip (2614KB) -
download TIDA-010025 CAD Files.zip (3698KB) -
download TIDA-010025 Gerber.zip (1507KB)
TIDA-010065 — This reference design is a simplified architecture for generating an isolated power supply for isolated amplifiers for measuring isolated voltages and currents. A fully integrated DC/DC converter with reinforced isolation operating from a 5-V input with configurable 5-V or 5.4-V output (headroom for (...)
Design files
-
download TIDA-010065 BOM Files.zip (376KB) -
download TIDA-010065 Assembly Files.zip (1005KB) -
download TIDA-010065 Layer Plots.zip (3172KB) -
download TIDA-010065 CAD Files.zip (6440KB) -
download TIDA-010065 Gerber.zip (1179KB)
TIDA-00366 — This design provides a reference solution for a three-phase inverter rated up to 10kW, designed using the reinforced isolated gate driver UCC21530, reinforced isolated amplifiers AMC1301 and AMC1311, and MCU TMS320F28027. Lower system cost is achieved by using the AMC1301 to measure motor current (...)
Design files
-
download TIDA-00366 Assembly Drawing (Rev. B).pdf (906KB) -
download TIDA-00366 BOM (Rev. B).pdf (105KB) -
download TIDA-00366 Altium (Rev. B).zip (2891KB) -
download TIDA-00366 Gerber (Rev. B).zip (586KB) -
download TIDA-00366 PCB (Rev. B).pdf (3165KB)
TIDM-TM4C129CAMERA — This design implements a network camera with a QVGA display panel and an embedded web server for remote monitoring. With a memory footrpint of 250KB for the web server, there is ample memory available on the TM4C129x microcontroller for additional customizations.
Design files
-
download Camera Reference Design for ARM ® Cortex®-M Microcontrollers (MCUs) BOM.pdf (108KB) -
download Camera Reference Design for ARM ® Cortex®-M Microcontrollers Assembly Drawing.pdf (181KB) -
download Camera Reference Design for ARM ® Cortex®-M Microcontrollers (MCUs) PCB.pdf (1047KB) -
download Camera Reference Design for ARM ® Cortex®-M Microcontrollers (MCUs) CAD Files.zip (1796KB) -
download Camera Reference Design for ARM ® Cortex®-M Microcontrollers (MCUs) Gerber.zip (45KB)
TIDEP0043 — The acontis EC-Master EtherCAT Master stack is a highly portable software stack that can be used on various embedded platforms. The EC-Master supports the high performance TI Sitara MPUs, it provides a sophisticated EtherCAT Master solution which customers can use to implement EtherCAT (...)
TIDA-01165 — Reference design TIDA-01165 is an analog controller for IR Filters. This design highlights the DRV8837C motor driver used to open and close an Infrared Filter when the module is exposed to high intensity sunlight. The simplified layout is suited to cost-conscious applications while also (...)
Design files
-
download TIDA-01165 BOM.pdf (59KB) -
download TIDA-01165 Assembly Drawing.pdf (128KB) -
download TIDA-01165 PCB.pdf (955KB) -
download TIDA-01165 CAD Files.zip (573KB) -
download TIDA-01165 Gerber.zip (2789KB)
TIDEP0054 — This TI Design implements a solution for high-reliability, low-latency network communications for substation automation equipment in Smart Grid transmission and distribution networks. It supports the Parallel Redundancy Protocol (PRP) specification in the IEC 62439 standard using the PRU-ICSS. This (...)
Design files
-
download Parallel Redundancy Protocol Ethernet for Substation Automation BOM.pdf (135KB) -
download Parallel Redundancy Protocol Ethernet for Substation Automation Assembly Drawing.pdf (1192KB) -
download Parallel Redundancy Protocol Ethernet for Substation Automation Layer Plots.pdf (1366KB) -
download Parallel Redundancy Protocol Ethernet for Substation Automation CAD Files.zip (3014KB)
TIDEP0036 — The TIDEP0036 reference design provides an example of the ease of running TI optimized Opus encoder/decoder on the TMS320C6657 device. Since Opus supports a a wide range of bit rates, frame sizes and sampling rates, all with low delay, it has applicability for voice communications, networked audio (...)
Design files
-
download Using the TMS320C6657 to Implement Efficient OPUS Codec Solution BOM.pdf (191KB) -
download Using the TMS320C6657 to Implement Efficient OPUS Codec Solution PCB.zip (4763KB) -
download Using the TMS320C6657 to Implement Efficient OPUS Codec Solution CAD Files.zip (1728KB) -
download Using the TMS320C6657 to Implement Efficient OPUS Codec Solution Gerber.zip (9013KB)
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
DSBGA (YZP) | 5 | View options |
SC70 (DCK) | 5 | View options |
SON (DRY) | 6 | View options |
SON (DSF) | 6 | View options |
SOT-23 (DBV) | 5 | View options |
SOT-5X3 (DRL) | 5 | View options |
X2SON (DPW) | 5 | View options |
Ordering & quality
Information included:
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Support & training
TI E2E™ forums with technical support from TI engineers
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.