SCES274J May   1999  – June 2026 SN74LVCZ244A

PRODUCTION DATA  

  1.   1
  2.   2
  3. 1 Features
  4. 2 Applications
  5. 3 Description
  6. 4 Pin Configuration and Functions
  7. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics, –40°C to 85°C
    7. 5.7 Switching Characteristics, –40°C to 125°C
    8. 5.8 Operating Characteristics
    9. 5.9 Typical Characteristics
  8. 6 Parameter Measurement Information
    1. 6.1 VCC = 2.7V and 3.3V ± 0.3V
  9.   19
  10. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS 3-State Outputs
      2. 7.3.2 Partial Power Down (Ioff)
      3. 7.3.3 Standard CMOS Inputs
      4. 7.3.4 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  11. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  12. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  13. 10Revision History
  14. 11Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

PACKAGE PINS THERMAL METRIC(1) UNIT
RθJA RθJC(top) RθJB ΨJT ΨJB RθJC(bot)
PW (TSSOP) 20 120.3 62.5 82.4 16.0 81.5 N/A °C/W
DGS (VSSOP) 20 129.9 72.4 86.1 18.6 85.8 N/A °C/W
RKS (VQFN) 20 87.2 93.4 59.8 24.9 59.6 44.3 °C/W
DB (SSOP) 20 97.7 59.4 52.9 21.4 52.5 - °C/W
DW (SOIC) 20 78.7 45.0 46.2 18.3 45.8 - °C/W
NS (SOP) 20 77.9 44.5 45.5 18.3 45.1 - °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.