SCES274J May   1999  – June 2026 SN74LVCZ244A

PRODUCTION DATA  

  1.   1
  2.   2
  3. 1 Features
  4. 2 Applications
  5. 3 Description
  6. 4 Pin Configuration and Functions
  7. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics, –40°C to 85°C
    7. 5.7 Switching Characteristics, –40°C to 125°C
    8. 5.8 Operating Characteristics
    9. 5.9 Typical Characteristics
  8. 6 Parameter Measurement Information
    1. 6.1 VCC = 2.7V and 3.3V ± 0.3V
  9.   19
  10. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS 3-State Outputs
      2. 7.3.2 Partial Power Down (Ioff)
      3. 7.3.3 Standard CMOS Inputs
      4. 7.3.4 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  11. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  12. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  13. 10Revision History
  14. 11Mechanical, Packaging, and Orderable Information

10 Revision History

Changes from October 1, 2014 to June 1, 2026 (from Revision I (October 2014) to Revision J (June 2026))

  • Add RKS package optionsGo
  • Moved Tstg to Absolute Maximum Ratings tableGo
  • Change Handling Ratings to ESD Ratings Go
  • Changed Junction-to-ambient thermal resistance value for PW package from: 103.5°C/W to: 120.3°C/WGo
  • Changed Junction-to-case (top) thermal resistance value for PW package from: 37.9°C/W to: 62.5°C/WGo
  • Changed Junction-to-board characterization value for PW package from: 54.5°C/W to: 82.4°C/WGo
  • Changed Junction-to-top characterization value for PW package from: 3.3°C/W to: 16°C/WGo
  • Changed Junction-to-board characterization value for PW package from: 53.9°C/W to: 81.5°C/WGo
  • Updated Overview, Application and Implementation, Device and Documentation Support sections to extend detailed feature descriptions and more detailed information. Go
  • Added parallel trace spacing recommendation to layout guidelines. Changed wording of "Avoid branches; buffer signals that must branch separately" to "Avoid branches; buffer each signal that must branch separately"Go

Changes from Revision H (August 2003) to Revision I (October 2014)

  • Updated document to new TI data sheet standards.Go
  • Deleted Ordering Information table.Go
  • Changed Ioff bullet in Features. Go
  • Added Applications.Go
  • Added Handling Ratings table.Go
  • Changed Max operating temperature to 125°C in Recommended Operating Conditions table. Go
  • Added Thermal Information table.Go
  • Added –40°C TO 125°C temperature range to Electrical Characteristics table.Go
  • Added Switching Characteristics table for –40°C TO 125°C temperature range.Go
  • Added Typical Characteristics section.Go
  • Added Power Supply Recommendations and Layout sections.Go