SCES584D June   2005  – May 2026 SN74LVC8T245

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information DB, DBQ and DGV
    5. 5.5  Thermal Information PW and RHL
    6. 5.6  Electrical Characteristics
    7. 5.7  Switching Characteristics, VCCA = 1.8V ± 0.15V
    8. 5.8  Switching Characteristics, VCCA = 2.5V ± 0.2V
    9. 5.9  Switching Characteristics, VCCA = 3.3V ± 0.3V
    10. 5.10 Switching Characteristics, VCCA = 5V ± 0.5V
    11. 5.11 Operating Characteristics
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fully Configurable Dual-Rail Design Allows Each Port to Operate Over the Full 1.65V to 5.5V Power-Supply Range
      2. 7.3.2 Ioff Supports Partial-Power-Down Mode Operation
      3. 7.3.3 Glitch-free Power Supply Sequencing
      4. 7.3.4 Balanced High-Drive CMOS Push-Pull Outputs
      5. 7.3.5 VCC Isolation and VCC Disconnect
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.4 Thermal Information DB, DBQ and DGV

THERMAL METRIC(1)DBDBQDGVUNIT
24 PINS24 PINS24 PINS
RθJAJunction-to-ambient thermal resistance90.781.291.1°C/W
RθJC(top)Junction-to-case (top) thermal resistance51.944.823.7
RθJBJunction-to-board thermal resistance49.734.544.5
ψJTJunction-to-top characterization parameter18.89.50.6
ψJBJunction-to-board characterization parameter49.337.244.1
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/AN/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application note.