SCES643L November   2006  – February 2026 TXB0108

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics (DGS/RUK/RKS)
    6. 5.6  Electrical Characteristics (Other Packages)
    7. 5.7  Timing Requirements: VCCA = 1.2V
    8. 5.8  Timing Requirements: VCCA = 1.5V ± 0.1V
    9. 5.9  Timing Requirements: VCCA = 1.8V ± 0.15V
    10. 5.10 Timing Requirements: VCCA = 2.5V ± 0.2V
    11. 5.11 Timing Requirements: VCCA = 3.3V ± 0.3V
    12. 5.12 Switching Characteristics: VCCA = 1.2V (DGS/RUK/RKS)
    13. 5.13 Switching Characteristics: VCCA = 1.2V (Other Packages)
    14. 5.14 Switching Characteristics: VCCA = 1.5V ± 0.1V (DGS/RUK/RKS)
    15. 5.15 Switching Characteristics: VCCA = 1.5V ± 0.1V (Other Packages)
    16. 5.16 Switching Characteristics: VCCA = 1.8V ± 0.15V (DGS/RUK/RKS)
    17. 5.17 Switching Characteristics: VCCA = 1.8V ± 0.15V (Other Packages)
    18. 5.18 Switching Characteristics: VCCA = 2.5V ± 0.2V (DGS/RUK/RKS)
    19. 5.19 Switching Characteristics: VCCA = 2.5V ± 0.2V (Other Packages)
    20. 5.20 Switching Characteristics: VCCA = 3.3V ± 0.3V (DGS/RUK/RKS)
    21. 5.21 Switching Characteristics: VCCA = 3.3V ± 0.3V (Other Packages)
    22. 5.22 Operating Characteristics
    23. 5.23 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Input Driver Requirements
      3. 7.3.3 Output Load Considerations
      4. 7.3.4 Enable and Disable
      5. 7.3.5 Pullup or Pulldown Resistors on I/O Lines
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

4 Pin Configuration and Functions

TXB0108 DGS/PW Package (Top View)Figure 4-1 DGS/PW Package (Top View)
TXB0108 RGY/RKS Package (Top View)Figure 4-3 RGY/RKS Package (Top View)
TXB0108 YZPR2 PACKAGE(BALL SIDE VIEW)Figure 4-5 YZPR2 PACKAGE(BALL SIDE VIEW)
TXB0108 DQS Package (Top View)Figure 4-2 DQS Package (Top View)
TXB0108 RUK Package (Top View)Figure 4-4 RUK Package (Top View)
TXB0108 NME/GXY/ZXY PACKAGE(BOTTOM VIEW)Figure 4-6 NME/GXY/ZXY PACKAGE(BOTTOM VIEW)
A. For the RKS/RGY/RUK package, the exposed center thermal pad must be connected to ground.
B. Pullup resistors are not required on both sides for Logic I/O.
C. If pullup or pulldown resistors are needed, the resistor value must be over 50kΩ.
D. 50kΩ is a safe recommended value, if the customer can accept higher VOL or lower VOH, smaller pullup or pulldown resistor is allowed, the draft estimation is VOL = VCCOUT × 4.5k/(4.5k + RPU) and VOH = VCCOUT × RDW/(4.5k + RDW).
E. If pullup resistors are needed, please refer to the TXS0108 or contact TI.
F. For detailed information, please refer A Guide to Voltage Translation With TXB-Type Translators.
Table 4-1 Pin Functions
PINI/O(1)FUNCTION
SIGNAL NAMEPW, RGY NO.DQS NO.RUK NO.YZP GRID LOCATOR
A11119A3I/OInput/output 1. Referenced to VCCA.
VCCA2520C4SA-port supply voltage. 1.1V ≤ VCCA ≤ 3.6V, VCCA ≤ VCCB.
A2321A4I/OInput/output 2. Referenced to VCCA.
A3432B3I/OInput/output 3. Referenced to VCCA.
A4543B4I/OInput/output 4. Referenced to VCCA.
A5674C3I/OInput/output 5. Referenced to VCCA.
A6785E4I/OInput/output 6. Referenced to VCCA.
A7896D3I/OInput/output 7. Referenced to VCCA.
A89107E3I/OInput/output 8. Referenced to VCCA.
OE1068D4IOutput enable. Pull OE low to place all outputs in 3-state mode. Referenced to VCCA.
GND11159D1SGround
B8121110E2I/OInput/output 8. Referenced to VCCB.
B7131211D2I/OInput/output 7. Referenced to VCCB.
B6141312E1I/OInput/output 6. Referenced to VCCB.
B5151413C2I/OInput/output 5. Referenced to VCCB.
B4161714B1I/OInput/output 4. Referenced to VCCB.
B3171815B2I/OInput/output 3. Referenced to VCCB.
B2181916A1I/OInput/output 2. Referenced to VCCB.
VCCB191617C1SB-port supply voltage. 1.65V ≤ VCCB  ≤ 5.5V.
B1202018A2I/OInput/output 1. Referenced to VCCB.
Thermal Pad——For the RGY/RUK package, the exposed center thermal pad must be connected to ground.
(1) I = input, O = output, I/O = input and output, S = power supply
Table 4-2 Pin Assignments (20-Ball NME/GXY/ZXY Package)
12345
DVCCBB2B4B6B8
CB1B3B5B7GND
BA1A3A5A7OE
AVCCAA2A4A6A8