8-Bit Bidirectional Voltage-Level Shifter with Auto Direction Sensing and +/-15-kV ESD Protect
Product details
Parameters
Package | Pins | Size
Features
- 1.2 V to 3.6 V on A Port and 1.65 V to 5.5 V on B Port (VCCA ≤ VCCB)
- VCC Isolation Feature – If Either VCC Input Is at GND, All Outputs Are in the High-Impedance State
- OE Input Circuit Referenced to VCCA
- Low Power Consumption, 4-µA Max ICC
- Ioff Supports Partial-Power-Down Mode Operation
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- A Port
- 2000-V Human-Body Model (A114-B)
- 1000-V Charged-Device Model (C101)
- B Port
- ±15-kV Human-Body Model (A114-B)
- ±8-kV Human-Body Model (A114-B) (YZP Package Only)
- 1000-V Charged-Device Model (C101)
- A Port
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Description
This 8-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA should not exceed VCCB.
When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.
The TXB0108 is designed so that the OE input circuit is supplied by VCCA.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
To ensure the high-impedance state during power-up or power-down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | TXB0108 8-Bit Bidirectional Voltage-Level Translator With Auto-Direction Sensing datasheet (Rev. H) | Aug. 25, 2020 |
Selection guide | Voltage translation buying guide | Jun. 13, 2019 | |
Application note | Effects of pullup and pulldown resistors on TXS and TXB devices (Rev. A) | Mar. 28, 2018 | |
Application note | Factors Affecting VOL for TXS and LSF Auto-bidirectional Translation Devices | Nov. 19, 2017 | |
Application note | Biasing Requirements for TXS, TXB, and LSF Auto-Bidirectional Translators | Oct. 30, 2017 | |
Application note | A Guide to Voltage Translation With TXS-Type Translators | Jun. 29, 2010 | |
Application note | A Guide to Voltage Translation With TXB-Type Translators | Mar. 03, 2010 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
Features
- Board design allows for versatility in evaluation
- Supports a wide-range of logic devices
Description
Features
- Board design allows for versatility in evaluation
- Supports a wide-range of logic and translation devices with included dual supply support
- Board has 9 sections that can be broken apart for a smaller form factor
Description
Features
- Supports the TXB0101, TXB0102, TXB0104, TXB0108
- Supports DCK, DCU, RUT and RGY packages of TI
- Option of individual external loading per channel
- Additional package options supported on the same footprint
Design tools & simulation
Reference designs
Design files
-
download TIDA-01435 BOM.pdf (96KB)
Design files
-
download TIDA-00352 BOM (Daughter Card).pdf (236KB) -
download TIDA-00352 BOM (Motherboard).pdf (283KB) -
download TIDA-00352 PCB (Daughter Card).pdf (1522KB) -
download TIDA-00352 PCB (Motherboard).pdf (6984KB) -
download TIDA-00352 CAD Files (Daughter Card).zip (1148KB) -
download TIDA-00352 CAD Files (Motherboard).zip (2759KB)
Design files
-
download TIDA-00309 BOM.pdf (184KB) -
download TIDA-00309 PCB.pdf (6984KB) -
download TIDA-00309 CAD Files.zip (298KB) -
download TIDA-00309 Gerber.zip (2361KB)
Design files
-
download TIDA-00269 BOM.pdf (241KB)
Design files
-
download TIDA-00234 BOM.pdf (62KB) -
download TIDA-00234 Gerber.zip (1083KB)
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
BGA MICROSTAR JUNIOR (ZXY) | 20 | View options |
DSBGA (YZP) | 20 | View options |
NFBGA (NME) | 20 | View options |
TSSOP (PW) | 20 | View options |
USON (DQS) | 20 | View options |
VQFN (RGY) | 20 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Support & training
TI E2E™ forums with technical support from TI engineers
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