SCES648B February   2006  – August 2026 SN74LVC1G32-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, CL = 15pF
    7. 5.7  Switching Characteristics, 1.8V and 2.5V
    8. 5.8  Switching Characteristics, 3.3V and 5V
    9. 5.9  Operating Characteristics
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

10 Revision History

Changes from January 1, 2019 to August 14, 2026 (from Revision A (January 2019) to Revision B (August 2026))

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Changed Junction-to-ambient thermal resistance value for DBV package from: 229°C/W to: 357.1°C/WGo
  • Changed Junction-to-case (top) thermal resistance value for DBV package from: 164°C/W to: 263.7°C/WGo
  • Changed Junction-to-board characterization value for DBV package from: 62°C/W to: 264.4°C/WGo
  • Changed Junction-to-top characterization value for DBV package from: 44°C/W to: 195.6°C/WGo
  • Changed Junction-to-board characterization value for DBV package from: 62°C/W to: 262.2°C/WGo
  • Changed Junction-to-ambient thermal resistance value for DCK package from: 278°C/W to: 371°C/WGo
  • Changed Junction-to-case (top) thermal resistance value for DCK package from: 93°C/W to: 297.5°C/WGo
  • Changed Junction-to-board characterization value for DCK package from: 65°C/W to: 258.6°C/WGo
  • Changed Junction-to-top characterization value for DCK package from: 2°C/W to: 195.6°C/WGo
  • Changed Junction-to-board characterization value for DCK package from: 64°C/W to: 256.2°C/WGo

Changes from Revision * (February 2006) to Revision A (January 2019)

  • Changed data sheet format to new TI standard Go
  • Added SON (6) DRY package to Device Information table Go
  • Added DRY Package to Pin Configuration and Functions section. Go