SCES727D June   2008  – May 2025 TXB0104-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics (BQA)
    6. 5.6  Electrical Characteristics (Other Packages)
    7. 5.7  Timing Requirements: VCCA = 1.2V
    8. 5.8  Timing Requirements: VCCA = 1.5V ± 0.1V
    9. 5.9  Timing Requirements: VCCA = 1.8V ± 0.15V
    10. 5.10 Timing Requirements: VCCA = 2.5V ± 0.2V
    11. 5.11 Timing Requirements: VCCA = 3.3V ± 0.3V
    12. 5.12 Switching Characteristics: VCCA = 1.2V (BQA)
    13. 5.13 Switching Characteristics: VCCA = 1.2V (Other Packages)
    14. 5.14 Switching Characteristics: VCCA = 1.5V ± 0.1V (BQA)
    15. 5.15 Switching Characteristics: VCCA = 1.5V ± 0.1V (Other Packages)
    16. 5.16 Switching Characteristics: VCCA = 1.8V ± 0.15V (BQA)
    17. 5.17 Switching Characteristics: VCCA = 1.8V ± 0.15V (Other Packages)
    18. 5.18 Switching Characteristics: VCCA = 2.5V ± 0.2V (BQA)
    19. 5.19 Switching Characteristics: VCCA = 2.5V ± 0.2V (Other Packages)
    20. 5.20 Switching Characteristics: VCCA = 3.3V ± 0.3V
    21. 5.21 Operating Characteristics
    22. 5.22 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Input Driver Requirements
      3. 7.3.3 Output Load Considerations
      4. 7.3.4 Enable and Disable
      5. 7.3.5 Pullup or Pulldown Resistors on I/O Lines
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC (1)TXB0104-Q1UNIT
PWRGYRUTBQA
14 PINS14 PINS12 PINS14 PINS
RθJAJunction-to-ambient thermal resistance12152.8119.8

77.1

°C/W
RθJC(top)Junction-to-case (top) thermal resistance5067.742.6

80.7

RθJBJunction-to-board thermal resistance62.828.952.5

46.9

ψJTJunction-to-top characterization parameter6.42.60.7

6.1

ψJBJunction-to-board characterization parameter62.229.052.3

46.8

RθJC(bot)Junction-to-case (bottom) thermal resistanceN/A9.3N/A

23.3

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application note.