SCES826D March   2011  – October 2025 SN74LVC1G07-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Operating Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information (Open Drain)
    1. 6.1 PMI
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

10 Revision History

Changes from Revision C (June 2025) to Revision D (October 2025)

  • Changed Junction-to-ambient thermal resistance value for DCK package from: 301.2°C/W to: 371.0°C/W Go
  • Changed Junction-to-case (top) thermal resistance value for DCK package from: 186.5°C/W to: 297.5°C/WGo
  • Changed Junction-to-board thermal resistance value for DCK package from: 111.8°C/W to: 258.6°C/WGo
  • Changed Junction-to-top characterization value for DCK package from: 78.3°C/W to: 195.6°C/WGo
  • Changed Junction-to-board characterization value for DCK package from: 110.6°C/W to: 256.2°C/WGo

Changes from Revision B (May 2019) to Revision C (June 2025)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Changed the Device Information table to Package Information Go
  • Changed Junction-to-ambient thermal resistance value for DBV package from: 269.3°C/W to: 357.1°C/W Go
  • Changed Junction-to-case (top) thermal resistance value for DBV package from: 175.2°C/W to: 263.7°C/WGo
  • Changed Junction-to-board thermal resistance value for DBV package from: 104.9°C/W to: 264.4°C/WGo
  • Changed Junction-to-top characterization value for DBV package from: 73.4°C/W to: 195.6°C/WGo
  • Changed Junction-to-board characterization value for DBV package from: 104.5°C/W to: 262.2°C/WGo

Changes from Revision A (February 2017) to Revision B (May 2019)