SCES945A May   2022  – October 2025 CDCBT1001

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power Down Tolerant Input
      2. 6.3.2 Up Conversion
    4. 6.4 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Processor Clock Up Translation
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Layout Guidelines

To provide reliability of the device, follow the common printed-circuit board layout guidelines listed below:

  • Use bypass capacitors on power supplies.
  • Use short trace lengths to avoid excessive loading.

Figure 7-2 shows an example layout for the DPW (X2SON-5) package. This example layout includes two 0402 (metric) capacitors, and uses the measurements listed in the package outline drawing appended to the end of this data sheet. A via of diameter 0.1mm (3.973mil) is placed directly in the center of the device. This via can be used to trace out the center pin connection through another board layer, or the via can be left out of the layout.