SCES982A May   2026  – June 2026 TXB0606

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCCA = 0.9V
    7. 5.7  Switching Characteristics, VCCA = 1.2V ± 0.1V
    8. 5.8  Switching Characteristics, VCCA = 1.5V ± 0.1V
    9. 5.9  Switching Characteristics, VCCA = 1.8V ± 0.15V
    10. 5.10 Switching Characteristics: TMAX (-40°C to 125°C) 
    11. 5.11 Operating Characteristics
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Input Driver Requirements
      3. 7.3.3 Output Load Considerations
      4. 7.3.4 Enable and Disable
      5. 7.3.5 Pullup or Pulldown Resistors on I/O Lines
      6. 7.3.6 Dummy Cycles
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

8.1 Application Information

The TXB0606 device can be used in level-translation applications for interfacing devices or systems operating at different interface voltages with one another. It can only translate push-pull CMOS logic outputs. If for open-drain signal translation, please refer to TI TXS010X products. Any external pulldown or pullup resistors are recommended larger than 20kΩ.

The device features enhanced output drive strength for use in high-speed interfaces such as QSPI, OSPI, eSPI, etc. The device is designed to support high-drive applications with either a lumped capacitive load of up to 100pF at 109Mbps (1.8 to 3.3V translation) or a signal trace length of up to 20 inches with a 50pF load at 124Mbps (1.8 to 3.3V translation).