SCES988B June   2025  – January 2026 TXS0104W

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 XPin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCCA = 1.2 V
    7. 5.7  Switching Characteristics, VCCA = 1.5 ± 0.1 V
    8. 5.8  Switching Characteristics, VCCA = 1.8 ± 0.15 V
    9. 5.9  Switching Characteristics, VCCA = 2.5 ± 0.2 V
    10. 5.10 Switching Characteristics, VCCA = 3.3 ± 0.3 V
    11. 5.11 Switching Characteristics: Tsk, TMAX
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Load Circuits
    2. 6.2 Voltage Waveforms
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Input Driver Requirements
      3. 7.3.3 Enable and Disable
      4. 7.3.4 Pullup and Pulldown Resistors on I/O Lines
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

4 XPin Configuration and Functions

TXS0104W BQA Package,14-Pin WQFN(Top View)
NC - No internal connection
Figure 4-1 BQA Package,14-Pin WQFN(Top View)
TXS0104W D and PW Package,14-Pin SOIC and TSSOP(Top View)
NC - No internal connection
Figure 4-3 D and PW Package,14-Pin SOIC and TSSOP(Top View)
TXS0104W RGY Package,14-Pin VQFN(Top View)
NC - No internal connection
Figure 4-2 RGY Package,14-Pin VQFN(Top View)
Table 4-1 Pin Functions: D, PW, or RGY
PINTYPE(1)DESCRIPTION
NAMENO.
A12I/OInput/output A1. Referenced to VCCA.
A23I/OInput/output A2. Referenced to VCCA.
A34I/OInput/output A3. Referenced to VCCA.
A45I/OInput/output A4. Referenced to VCCA.
B113I/OInput/output B1. Referenced to VCCB.
B212I/OInput/output B2. Referenced to VCCB.
B311I/OInput/output B3. Referenced to VCCB.
B410I/OInput/output B4. Referenced to VCCB.
GND7—Ground
OE8I3-state output-mode enable. Pull OE low to place all outputs in 3-state mode. Referenced to VCCA.
VCCA1—A-port supply voltage. 1.2V ≤ VCCA  ≤ 3.6V and VCCA can be greater than, less than, or equal to VCCB.
VCCB14—B-port supply voltage. 1.65V ≤ VCCB  ≤ 5.5V.
Thermal Pad—For the RGY package, the exposed center thermal pad must be connected to ground
TXS0104W RUT Package, 12-Pin UQFN (Transparent Top View)Figure 4-4 RUT Package, 12-Pin UQFN (Transparent Top View)
Table 4-2 Pin Functions: RUT
PINTYPE(1)DESCRIPTION
NAMENO.
A12I/OInput/output A1. Referenced to VCCA.
A23I/OInput/output A2. Referenced to VCCA.
A34I/OInput/output A3. Referenced to VCCA.
A45I/OInput/output A4. Referenced to VCCA.
B110I/OInput/output B1. Referenced to VCCB.
B29I/OInput/output B2. Referenced to VCCB.
B38I/OInput/output B3. Referenced to VCCB.
B47I/OInput/output B4. Referenced to VCCB.
GND6—Ground
OE12I3-state output-mode enable. Pull OE low to place all outputs in 3-state mode. Referenced to VCCA.
VCCA1—A-port supply voltage. 1.2V ≤ VCCA  ≤ 3.6V and VCCA  can be greater than, less than, or equal to VCCB.
VCCB11—B-port supply voltage. 2.3V ≤ VCCB  ≤ 5.5V
(1) I = input, O = output