SCEU026 February   2024

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 EVM Features
    2. 2.2 Hardware Description
      1. 2.2.1 Headers
      2. 2.2.2 Bypass Capacitors
      3. 2.2.3 Pull-up and Pull-down Resistors and Capacitive Loading
      4. 2.2.4 SMA Connectors
      5. 2.2.5 Set-up and Measurements
  9. 3Hardware Design Files
    1. 3.1 Schematic
    2. 3.2 PCB Layout
    3. 3.3 Bill of Materials
  10. 4Additional Information
    1.     Trademarks

1.3 Specification

Refer to the TXV or the Pin-to-Pin (P2P) data sheets for the device recommended conditions and specifications. See Table 3-3 for the corresponding data sheets.