SCEU026 February   2024

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 EVM Features
    2. 2.2 Hardware Description
      1. 2.2.1 Headers
      2. 2.2.2 Bypass Capacitors
      3. 2.2.3 Pull-up and Pull-down Resistors and Capacitive Loading
      4. 2.2.4 SMA Connectors
      5. 2.2.5 Set-up and Measurements
  9. 3Hardware Design Files
    1. 3.1 Schematic
    2. 3.2 PCB Layout
    3. 3.3 Bill of Materials
  10. 4Additional Information
    1.     Trademarks

Features

  • SMA connectors for high-speed data throughput.
  • 50Ω termination resistors for impedance control.
  • OE control for disabling and enabling the outputs.
  • DIR control for configuring A-to-B or B-to-A voltage translation (TXV0108-EVM).
  • Pull-up or pull-down resistors for avoiding floating inputs.
  • Flexibility for capacitive loading on all data IO pins.
  • Jumper test points for probing input and output signals.
  • Designed and optimized for skew measurements in the pico-second range.