SCLS387 Data sheet

SCLS387N September 1997 – September 2025 SN74LV08A

PRODUCTION DATA

5.4 Thermal Information

THERMAL METRIC⁽¹⁾		SN74LV08A							UNIT
		D	DB	DGV	N	NS	PW	RGY
		14 PINS	14 PINS	14 PINS	14 PINS	14 PINS	14 PINS	14 PINS
R_θJA	Junction-to-ambient thermal resistance	90.6	107.1	129.0	57.4	90.7	122.6	57.5	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	50.9	59.6	52.1	44.9	48.3	51.4	70.8
R_θJB	Junction-to-board thermal resistance	44.8	54.4	62.0	37.2	49.4	64.4	33.6
ψ_JT	Junction-to-top characterization parameter	14.7	20.5	6.5	30.1	14.6	6.7	3.4
ψ_JB	Junction-to-board characterization parameter	44.5	53.8	61.3	37.1	49.1	63.8	33.7
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	–	–	–	–	–	–	13.9

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).