SCLS601D December   2004  – April 2025 CD74HC4067-Q1 , CD74HCT4067-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Absolute Maximum Ratings
  7. 6 ESD Ratings
  8. 7 Thermal Information
  9. 8 Recommended Operating Conditions
  10. 9 Electrical Characteristics: HC Devices
  11. 10Electrical Characteristics: HCT Devices
  12. 11Switching Characteristics HC
  13. 12Switching Characteristics HCT
  14. 13Analog Channel Specifications
  15. 14Parameter Measurement Information
  16. 15Detailed Description
    1. 15.1 Functional Block Diagram
    2. 15.2 Device Functional Modes
  17. 16Device and Documentation Support
    1. 16.1 Receiving Notification of Documentation Updates
    2. 16.2 Support Resources
    3. 16.3 Trademarks
    4. 16.4 Electrostatic Discharge Caution
    5. 16.5 Glossary
  18. 17Revision History
  19. 18Mechanical, Packaging, and Orderable Information

7 Thermal Information

THERMAL METRIC (1) CD74HCx4067 UNIT
DW (SOIC) RGY (QFN) DGS (VSSOP) PW (TSSOP)
24 PINS 24 PINS 24 PINS 24 PINS
RθJA Junction-to-ambient thermal resistance  84.8 67.1 96.8 97.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 57.0 59.2 43.4 45.0 °C/W
RθJB Junction-to-board thermal resistance 59.5 45.4 58.7 62.7 °C/W
ΨJT Junction-to-top characterization parameter 29.0 9.3 3.9 5.20 °C/W
ΨJB Junction-to-board characterization parameter 59.0 45.1 58.2 62.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 34.7 N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.