SCPS314 December   2025 TCA9536-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 I2C Bus Timing Requirements
    8. 5.8 Switching Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 I/O Port
      2. 7.3.2 P3 or Interrupt (INT) Output
      3. 7.3.3 Pull-up Disable Functionality
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-On Reset
      2. 7.4.2 Powered-Up
    5. 7.5 Programming
      1. 7.5.1 I2C Interface
        1. 7.5.1.1 Writes
        2. 7.5.1.2 Reads
      2. 7.5.2 Software Reset Call
    6. 7.6 Register Maps
      1. 7.6.1 Device Address
      2. 7.6.2 Control Register and Command Byte
      3. 7.6.3 Register Descriptions
  9. 8 Application Information
    1. 8.1 Typical Application
      1. 8.1.1 Design Requirements
        1. 8.1.1.1 Minimizing ICC When I/Os Control LEDs
      2. 8.1.2 Detailed Design Procedure
      3. 8.1.3 Application Curves
  10. 9 Power Supply Recommendations
    1. 9.1 Power-On Reset
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) TCA9536-Q1 UNIT
DTM (X2SON)
8-PIN
RθJA Junction-to-ambient thermal resistance 193.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 110.7 °C/W
RθJB Junction-to-board thermal resistance 110.4 °C/W
ΨJT Junction-to-top characterization parameter 5.9 °C/W
ΨJB Junction-to-board characterization parameter 110.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.